Board level solder joint reliability model for flip-chip ball grid array packages under compressive loads

Abstract

The ever increasing power density in high performance microelectronic devices for large business computing and telecommunication infrastructure has led to several new reliability challenges for solder interconnects. One of them is the creep collapse and bridging of ball grid array (BGA) solder joints under heatsink compressive loads. In this study, the effect of heatsinking compressive load on the solder joint reliability is investigated by using both experimental and numerical approaches. A phenomenological life prediction model for both Sn36Pn2Ag and Sn3.8Ag0.7Cu solder joints subjected to constant compressive load is also proposed.

Relationship between crack propagation trends and grains in SnAgCu interconnects

“…the reliability researches of them are becoming more and more in-depth, especially the studies on lead-free solders like SnAgCu based ones [1][2][3][4].…”