Board level reliability improvement in eWLB (embedded wafer level BGA) packages

Chow, Seng Guan; Lin, Yaojian; Adams, Bernard; Yoon, Seung Wook

doi:10.1109/impact.2016.7799978

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Board level reliability improvement in eWLB (embedded wafer level BGA) packages

Cited by 3 publications

References 3 publications

State-of-the-Art Approach: System-on-Package

State-of-the-Art Approach: System-on-Package

Post-CMOS Fabrication Technology Enabling Simultaneous Fabrication of 3-D Solenoidal Micro-Inductors and Flexible I/Os

Reliability of embedded wafer level ball grid arrays in automotive applications

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