“…The milling process can be articially ground, or performed with a machine under xed rotation speeds, such as 300 rpm. 69,78 Milling rate and time of articial grinding are freely regulated, while those of machine milling are required to set a xed rotation rate and time, and the time to pause for machine resting. Except for IL, 68,69 other surface capping ligand molecules of 0D boron nanomaterials have been utilized during the solvent milling process, such as oleic acid, 72,73 poly(ethylene glycol) (PEG), 77 undecylenic acid (UND), 80 dopamine (DA), 80 and poly(vinyl pyrrolidone) (PVP).…”