Holzwerkstoffe Und Leime 2002
DOI: 10.1007/978-3-642-55938-9_13
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Cited by 2 publications
(2 citation statements)
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“…Although the acid conditions required for the polymerization of the furanic polymers may degrade the wood stability [ 43 , 44 ], some interesting methods to neutralize the conditions post-curing were proposed [ 45 , 46 ] and therefore, the furanic/phenolic copolymers were also preliminarily tested as wood adhesives for wood-to-wood bonding and particleboard production to observe whether or not these polymers present promising physical properties for replacing the existing adhesives.…”
Section: Introductionmentioning
confidence: 99%
“…Although the acid conditions required for the polymerization of the furanic polymers may degrade the wood stability [ 43 , 44 ], some interesting methods to neutralize the conditions post-curing were proposed [ 45 , 46 ] and therefore, the furanic/phenolic copolymers were also preliminarily tested as wood adhesives for wood-to-wood bonding and particleboard production to observe whether or not these polymers present promising physical properties for replacing the existing adhesives.…”
Section: Introductionmentioning
confidence: 99%
“…In Kapitel 4. Der Grund für die Annahme lag darin begründet, dass der äußerst dünne Klebefilm zu unzureichenden Klebstoffbenetzung aufgrund der rauen Oberflächenstruktur führen könnte, während PVAc-Leime wegen ihrer Beschaffenheit ein s. g. Fugenfüllvermögen besitzen (Dunky 2002a).…”
Section: Erlen-und Eichenfurnierunclassified