“…The HPs with a three-dimensional (3D) ABX 3 structure consist of monovalent organic (CH 3 NH 3 ,CH 3 (NH 2 ) 2 ) or inorganic (Cs, Rb) cations at the A site, divalent metal cations (Pb, Sn) at the B site, and halide anion (I, Br, or Cl) at the X-site, The HP-based RS memory devices have an on/off ratio on the order of over 10 4 with multilevel resistive switching and low operating voltages. , However, these devices suffer from poor endurance, short retention, and stability for use as memory and artificial synapse, which requires over 10 6 endurance. , These issues have been addressed through various measures such as defect control through an HP film with passivation layers, improving the morphology and crystallinity using the additive and solution coating method, and changing the structure from 3D to one-dimensional (1D) through monovalent cations and bivalent cations combination. − Also, the formation of heterojunction between zinc oxide based films and HP layers has been proposed to improve the resistive-switching memory properties , Despite the many studies, low endurance, short retention, multilevel resistive switching, and stability did not have enough improvement in the RS properties.…”