Bias voltage effect on magnetron sputtered titanium aluminum nitride TiAlN thin films properties

Abstract

In this study, a negative substrate bias voltage is used to tune the structural, morphological, mechanical and electrochemical properties of TiAlN coatings fundamental for protective coating applications. TiAlN thin films have been deposited on glass, (001)Si and stainless steel substrates by RF magnetron sputtering at a power density of 4.41 W/cm2. The deposition rate was determined from X-ray reflectivity measurements to 7.00 ± 0.05 nm/min. TiAlN films used in this work were deposited for 60 min to yield a film thickness of 420 nm. Structural analysis has shown that TiAlN coating forms a cubic (fcc) phase with orientations in (111), (200), (220) and (222) planes. The deposited coatings present maximum hardness (H = 37.9 GPa) at −75 V. The dependence of hardness and Young's modulus and corrosion resistance on microstructure has been established. Electrochemical studies by potentiodynamic polarization in aggressive environment (3.5 wt.% NaCl) have revealed that stainless steel substrate with TiAlN coating exhibits excellent corrosion resistance.

Variation on the Microstructure and Mechanical Properties of Ti-Al-N Films Induced by RF-ICP Ion Source Enhanced Reactive Nitrogen Plasma Atmosphere

“…Due to the respectable mechanical properties like high hardness, anti-corrosion, and superior oxidation resistance, Ti-Ai-N has attracted much attraction in dry and high speed cutting as the surface protection films for machine tools [1][2][3]. Nowadays, varieties of techniques have been developed for the fabrication of Ti-Al-N films including chemical vapor deposition [4], arc evaporation [5], ion plating [6], and reactive DC/RF sputtering [7]. During Ti-Al-N film deposition progress, the gas atmosphere is quite important and complex [8][9][10][11][12].…”