BGA sockets-a dendritic solution

Chan, Benson; Singh, Prabjit

doi:10.1109/ectc.1996.517428

Cited by 13 publications

(6 citation statements)

References 1 publication

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“…Spring-style (vertical or pogo type), metal filled (Elastomer), and cantilever (S-shape) are the main contact BGA-type package technologies [4][5][6][7][8]. The BGA test socket provides a separable electrical and mechanical connection between BGA-type packaging and Loadboard.…”

Section: Bga Test Socketmentioning

confidence: 99%

Study of contact degradation in final testing for BGA socket

Teng

Chen

Yen

et al. 2007

2007 International Conference on Electronic Materials and Packaging

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BGA socket is most important part in the final testing which selects the good or bad chip of BGA packages. When testing BGA-type packages using a BGA socket, the characteristic contact conditions and mechanisms of surface degradation in a low and stable contact are essential. However, the electrical contact between the pogo pin and the solder ball of the BGA-type package becomes unstable following repeated touchdown operations since particles from the package outline gradually accumulate on the crown tip of pogo pin. The contamination caused by these particles causes the contact resistance to increase. Accordingly, this study develops an experimental procedure for investigating the effect of the particle contamination on the magnitude and stability of the contact resistance. Initially, an experiment is performed to establish the contact resistance between a plated beryllium-copper (BeCu) pin at various number of touchdown. Subsequently, an experiment is conducted to investigate the accumulation of surface particles on the crown tip following multiple touchdowns of the pogo pin with the surface solder ball. The worn-out of crown tip following 6,830 and 36,580 touchdowns, respectively, is examined using a scanning electron microscope (SEM). The experimental results are then integrated to establish a suitable tradeoff between the contact resistance and the number of contacts for the time of socket clean.

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Section: Bga Test Socketmentioning

confidence: 99%

Study of contact degradation in final testing for BGA socket

Teng

Chen

Yen

et al. 2007

2007 International Conference on Electronic Materials and Packaging

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“…For burn-in sockets, 10 000 cycles is a typical value; for test sockets, 100 000 or more may be required. The requirement for production sockets is usually twenty-five to fifty cycles in their lifetime [17], [18].…”

Section: E Durabilitymentioning

confidence: 99%

Fundamental reliability issues associated with a commercial particle-in-elastomer interconnection system

Liu

Pecht²,

Xie³

2001

IEEE Trans. Comp. Packag. Technol.

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The use of very high I/O count electronic components, driven by higher performance and functionality requirements, has significantly impacted surface mount assembly yields. Metal particle-in-elastomer sockets were introduced to provide a solderless interconnection alternative with high I/O capability; easy assembly, rework, and maintenance; and the ability to upgrade components in the field. However, as a new technology, elastomer sockets need to be assessed in terms of their reliability.A successful reliability assessment must be based on an understanding of the functional, performance, and life requirements; the environmental and operational life-cycle conditions; materials and design properties; and potential failure modes and mechanisms. This paper presents recent studies by the CALCE Electronic Products and Systems Center in characterizing the materials and design properties of a commercially available (Thomas and Betts) metal particle-in-elastomer interconnection system. These studies revealed the potential failure modes and mechanisms of this elastomer socket, and can be used to select suitable application parameters when using this socket. The results may also serve as a reference for technology insertion and evaluation of other elastomer interconnection systems.

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“…A test socket is an electrical connector between the integrated circuit (IC) package and the automatic test equipment (ATE). [1][2][3][4][5][6] As the semiconductor manufacturing industry grows gradually, higher density, technologically more advanced, and more efficiently performing test sockets are required. The ball grid array (BGA) [1][2][3][4][5][6][7][8][9][10][11][12] IC package generally uses a test socket, which is assembled by numerous pogo pins positioned in appropriate locations.…”

Section: Introductionmentioning

confidence: 99%

“…[1][2][3][4][5][6] As the semiconductor manufacturing industry grows gradually, higher density, technologically more advanced, and more efficiently performing test sockets are required. The ball grid array (BGA) [1][2][3][4][5][6][7][8][9][10][11][12] IC package generally uses a test socket, which is assembled by numerous pogo pins positioned in appropriate locations. 3,4) However, the pogo pin test socket has various disadvantages, such as pitch limitation, high cost, low reproducibility, and serious ball damage.…”

Section: Introductionmentioning

confidence: 99%

Design and Fabrication of Highly Manufacturable Microelectromechanical Systems Test Sockets for Ball Grid Array Integrated Circuit Packages

Cho¹,

Kim

Kong

et al. 2011

Jpn. J. Appl. Phys.

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An InGaN laser diode operating at 398 nm and with output facet coated with a multi-layer anti-reflection coating has been operated within Littrow external cavities. A maximum manual tuning range of 6.3 nm has been achieved and a continuous tuning range of 0.8 GHz with a single piezo control. Stable single-longitudinal-mode operation has been obtained with a linewidth less than 11 MHz. The effects on total tuning range due to the orientation of the diode output facet within the Littrow cavity are discussed.

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BGA sockets-a dendritic solution

Cited by 13 publications

References 1 publication

Study of contact degradation in final testing for BGA socket

Study of contact degradation in final testing for BGA socket

Fundamental reliability issues associated with a commercial particle-in-elastomer interconnection system

Design and Fabrication of Highly Manufacturable Microelectromechanical Systems Test Sockets for Ball Grid Array Integrated Circuit Packages

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