BDAQ53, a versatile pixel detector readout and test system for the ATLAS and CMS HL-LHC upgrades

Daas, M.; Dieter, Y.; Dingfelder, J.; Frohne, Markus; Giakoustidis, G.; Hemperek, T.; Hinterkeuser, F.; Huegging, F.; Janssen, J.; Krüger, H.; Pohl, D.; Rymaszewski, P.; Standke, Mark; Vogt, M.; Wang, T.; Wermes, N.

doi:10.1016/j.nima.2020.164721

Cited by 19 publications

(16 citation statements)

References 9 publications

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“…Here cooling for operations with irradiated modules is provided by dry ice which allows them to reach temperatures as low as the chiller-based box, but without the flexibility of a precise temperature control. Two different data acquisition systems (DAQ) have been used to equalize the threshold and operate the RD53A chips: the BDAQ53 [21] developed by the Bonn Silicon Laboratory and the YARR system developed at LBNL [22]. Due to the large integration time of the MIMOSA26 sensors (about 300 µs) with respect to the DUTs (of the order of 25 ns), an additional reference plane made of a hybrid module composed of an FE-I4 chip and a planar sensor is used to provide timing information for track selection with 25 ns precision.…”

Section: Beam Test Measurementsmentioning

confidence: 99%

Novel 3D Pixel Sensors for the Upgrade of the ATLAS Inner Tracker

et al. 2021

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The ATLAS experiment will undergo a full replacement of its inner detector to face the challenges posed by the High Luminosity upgrade of the Large Hadron Collider (HL-LHC). The new Inner Tracker (ITk) will have to deal with extreme particle fluences. Due to its superior radiation hardness the 3D silicon sensor technology has been chosen to instrument the innermost pixel layer of ITk, which is the most exposed to radiation damage. Three foundries (CNM, FBK, and SINTEF), have developed and fabricated novel 3D pixel sensors to meet the specifications of the new ITk pixel detector. These are produced in a single-side technology on either Silicon On Insulator (SOI) or Silicon on Silicon (Si-on-Si) bonded wafers by etching both n- and p-type columns from the same side. With respect to previous generations of 3D sensors they feature thinner active substrates and smaller pixel cells of 50 × 50 and 25 × 100 µm2. This paper reviews the main design and technological issues of these novel 3D sensors, and presents their characterization before and after exposure to large radiation doses close to the one expected for the innermost layer of ITk. The performance of pixel modules, where the sensors are interconnected to the recently developed RD53A chip prototype for HL-LHC, has been investigated in the laboratory and at beam tests. The results of these measurements demonstrate the excellent radiation hardness of this new generation of 3D pixel sensors that enabled the project to proceed with the pre-production for the ITk tracker.

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Section: Beam Test Measurementsmentioning

confidence: 99%

Novel 3D Pixel Sensors for the Upgrade of the ATLAS Inner Tracker

et al. 2021

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“…Regarding the data taking, it has also been performed at several facilities using different kinds of test beams: at Deutsches Elektronen-Synchrotron (DESY) with an electron/positron beam at 5 GeV, at Fermilab with a proton beam at 120 GeV and at the CERN Super Proton Synchrotron (SPS) with a pion beam at 120 GeV. The telescope resolution in such test beam setups is around 2-10 µm, the data acquisition systems used are BDAQ [5] and Ph2 ACF, and the results have been obtained using only the RD53A linear front-end.…”

Section: Irradiation and Test Beam Setupsmentioning

confidence: 99%

Study of irradiated 3D pixel sensors from CNM

García

2023

Nuclear Instruments and Methods in Physics Research Section A:

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“…A perfect wafer yields up to 132 ITkPix-V1. To determine the yield, the University of Bonn has developed the following wafer probing setup with the BDAQ53 test system [5] at its heart. Figure 2 shows a simplified version of its components.…”

Section: Itkpix-v1 -Wafer Probing Setupmentioning

confidence: 99%

RD53B Wafer Testing for the ATLAS ITk Pixel Detector

Standke

2022

J. Phys.: Conf. Ser.

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RD53B/ITkPix-V1 is the most recent hybrid pixel readout chip development for the ATLAS pixel detector at the HL-LHC. It is the first full-scale 65 nm hybrid pixel-readout chip of its kind. ITkPix-V1 consists of more than one billion transistors with a high memory triplication ratio to cope with the high particle density at the heart of ATLAS. Chips will be as close to the interaction point as possible to optimize the resolution of impact parameters. The ITkPix-V1 chip features a 5-Gbit connection, with special data compression to deal with high hit intensities. In addition, a low-power, low-noise analog front-end is used to ensure high readout speeds and low detection thresholds. Failure of chips in ATLAS would be problematic. Therefore, a thorough test is necessary before and during production. For this purpose, the Bonn ATLAS group has developed BDAQ53, a fast and versatile simulation and testing environment that allows small and large-scale testing for ITkPix-V1 and its successor chips. This conference note will give an overview of the testing environment while focusing on large-scale wafer testing to evaluate ITkPix-V1’s suitability for its deployment at the HL-LHC.

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BDAQ53, a versatile pixel detector readout and test system for the ATLAS and CMS HL-LHC upgrades

Cited by 19 publications

References 9 publications

Novel 3D Pixel Sensors for the Upgrade of the ATLAS Inner Tracker

Novel 3D Pixel Sensors for the Upgrade of the ATLAS Inner Tracker

Study of irradiated 3D pixel sensors from CNM

RD53B Wafer Testing for the ATLAS ITk Pixel Detector

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