2004
DOI: 10.1016/j.apsusc.2003.08.009
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BCl3/Ne etching of III–V semiconductors in a planar inductively coupled plasma reactor

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Cited by 4 publications
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“…When using a photoresist mask, it has been shown that etching AlGaAs with BCl 3 chemistry (with Ar or neon (Ne)) can passivate sidewalls via the re-deposition of BCl x fragments, etch products and resist-containing residues [20,21]. N 2 is a common additive to chlorine species to intentionally degrade resists in order to produce sidewall passivation with a polymer deposition [12,21,22].…”
Section: Introductionmentioning
confidence: 99%
“…When using a photoresist mask, it has been shown that etching AlGaAs with BCl 3 chemistry (with Ar or neon (Ne)) can passivate sidewalls via the re-deposition of BCl x fragments, etch products and resist-containing residues [20,21]. N 2 is a common additive to chlorine species to intentionally degrade resists in order to produce sidewall passivation with a polymer deposition [12,21,22].…”
Section: Introductionmentioning
confidence: 99%