2009
DOI: 10.1016/j.apsusc.2009.08.009
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Etching and oxidation of InAs in planar inductively coupled plasma

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Cited by 3 publications
(2 citation statements)
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“…Evaporation of elemental arsenic decreases the effects of surface passivation. Similar regularities were found in (Dultsev & Kesler, 2009); the results of studies related to accumulation of As at InAs surface may be found in (Sun et al, 2008;. Optimal preparation modes of the surface of InAs (111) are surface etching in HCl-IPA solution for 5-30 minutes and subsequent annealing of samples in vacuum for 30-60 minutes at temperatures about (300 -350)°C.…”
Section: Preliminary Sample Preparationsupporting
confidence: 66%
“…Evaporation of elemental arsenic decreases the effects of surface passivation. Similar regularities were found in (Dultsev & Kesler, 2009); the results of studies related to accumulation of As at InAs surface may be found in (Sun et al, 2008;. Optimal preparation modes of the surface of InAs (111) are surface etching in HCl-IPA solution for 5-30 minutes and subsequent annealing of samples in vacuum for 30-60 minutes at temperatures about (300 -350)°C.…”
Section: Preliminary Sample Preparationsupporting
confidence: 66%
“…However, most of the chlorine-containing gases contain carbon and often problems are encountered with the deposition of polymer films during etching, resulting in a poor material surface quality, and therefore degraded device performances. Various surface treatment methods to improve the surface quality have been investigated, such as oxygen plasma treatment [8] and surface passivation techniques, etc. However, these methods seem to be complex, costly and time consuming.…”
mentioning
confidence: 99%