2010
DOI: 10.1002/adma.201001793
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Batch Fabrication of High‐Performance Planar Patch‐Clamp Devices in Quartz

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Cited by 18 publications
(20 citation statements)
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“…When a cell covers the electrode surrounded with a non-functionalized ring (Fig. 6B), the seal resistance ranges from 50–300 MΩ (Ν = 6), a finding consistent with the recessed electrode seal resistances found by others2021. When the cell covers an electrode with a functionalized gold ring (Fig.…”
Section: Resultssupporting
confidence: 81%
“…When a cell covers the electrode surrounded with a non-functionalized ring (Fig. 6B), the seal resistance ranges from 50–300 MΩ (Ν = 6), a finding consistent with the recessed electrode seal resistances found by others2021. When the cell covers an electrode with a functionalized gold ring (Fig.…”
Section: Resultssupporting
confidence: 81%
“…The performance of a planar chip is highly dependent on the material used. Quartz and glass [14], [19] have excellent insulation, hydrophilic, and mechanical properties over the silicon material [15], [16], [20]- [23], thus are more suitable for fabrication.…”
Section: ) Planar Chip Fabricationmentioning
confidence: 99%
“…However, the traditional PC technology is a really timeconsuming and laborious effort with rather low throughput. For the past decade, various types of PC microchips have been developed in several groups to enhance the throughput and efficiency over the conventional glasspipette based PC technology (Li 2006;Ionescu-Zanetti et al 2005;Penmetsa et al 2010;Nagarah et al 2010;Matthews and Judy 2006). It has been demonstrated that by using properly designed and fabricated micropipette, some PC microchips show reliable and consistent Gigaohms (GΩ) seal capability, indicating the possibility that the PC microchip can eventually replace the conventional glass-pipette PC technology.…”
Section: Introductionmentioning
confidence: 99%