Abstract:This paper describes a process for batch manufacturing, assembly, and packaging of metal alloy microrelays directly on printed circuit board (PCB) substrates for high-power radio frequency (RF) applications. Stainless steel cantilevers with Pt-Rh tips are mounted on Rogers 4003 PCB substrates to demonstrate the approach. A multilayer PCB design allows for the use of subsurface metal layers to transmit the RF signal into and out of the sealed encapsulation. The electrostatically actuated microrelays with 8.4-mm… Show more
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