Abstract:Conduction and valence band offsets are amongst the most crucial material parameters for semiconductor heterostructure device design, such as for high-electron mobility transistors or quantum-well infrared photodetectors. Due to its expected high spontaneous electrical polarization and the possibility of polarization doping at heterointerfaces similar to the AlGaN/InGaN/GaN system, the metastable orthorhombic κ-phase of Ga2O3 and its indium and aluminum alloy systems are a promising alternative for such device… Show more
“…The ΔE v of the AlBN/GaN heterojunction is calculated as follows. [ 35,36 ] where is the energy difference between the Ga 3 d and B 1 s CLs, which are measured in the AlBN/GaN interface samples (AlBN layers thickness is ≈5 nm). and are the energy differences of the CLs and valence band maximum (VBM) binding energy in the bulk AlBN samples (thickness ≈70 nm) and GaN substrates (thickness ≈5 μm), respectively.…”
Section: Resultsmentioning
confidence: 99%
“…Subsequently, ΔE c is determined by the following equation. [ 36 ] where and are the bandgaps of AlBN and GaN (3.4 eV), respectively. Using the determined bandgaps of AlBN, the calculated value of ΔE c was 2.67 ± 0.05 and 2.24 ± 0.05 eV for the as‐deposited and 800 °C PDA samples, respectively.…”
Section: Resultsmentioning
confidence: 99%
“…The ΔE v of the AlBN/GaN heterojunction is calculated as follows. [35,36] Figure 1. The atomic force microscope images of the surface of the a) as-deposited and b) 800 °C PDA films.…”
Considering the increasing demand for high current density, breakdown field, frequency, and temperature operation performance in III-nitride electronic devices, ensuring the high-temperature stability and reliability of dielectric films has become more challenging. [1][2][3][4] For high-electron-mobility transistors, inserting a dielectric film under gate metal or depositing the passivation with dielectrics on the gate-drain access region effectively reduces gate leakage, enlarges gate swing, and suppresses current collapse, which improve the device performance significantly. [5] Various binary metal oxide/nitride dielectrics, such as SiO 2 , [
“…The ΔE v of the AlBN/GaN heterojunction is calculated as follows. [ 35,36 ] where is the energy difference between the Ga 3 d and B 1 s CLs, which are measured in the AlBN/GaN interface samples (AlBN layers thickness is ≈5 nm). and are the energy differences of the CLs and valence band maximum (VBM) binding energy in the bulk AlBN samples (thickness ≈70 nm) and GaN substrates (thickness ≈5 μm), respectively.…”
Section: Resultsmentioning
confidence: 99%
“…Subsequently, ΔE c is determined by the following equation. [ 36 ] where and are the bandgaps of AlBN and GaN (3.4 eV), respectively. Using the determined bandgaps of AlBN, the calculated value of ΔE c was 2.67 ± 0.05 and 2.24 ± 0.05 eV for the as‐deposited and 800 °C PDA samples, respectively.…”
Section: Resultsmentioning
confidence: 99%
“…The ΔE v of the AlBN/GaN heterojunction is calculated as follows. [35,36] Figure 1. The atomic force microscope images of the surface of the a) as-deposited and b) 800 °C PDA films.…”
Considering the increasing demand for high current density, breakdown field, frequency, and temperature operation performance in III-nitride electronic devices, ensuring the high-temperature stability and reliability of dielectric films has become more challenging. [1][2][3][4] For high-electron-mobility transistors, inserting a dielectric film under gate metal or depositing the passivation with dielectrics on the gate-drain access region effectively reduces gate leakage, enlarges gate swing, and suppresses current collapse, which improve the device performance significantly. [5] Various binary metal oxide/nitride dielectrics, such as SiO 2 , [
“…Research on the In as well as Al alloy systems of the κ ‐phase is still relatively scarce, as up to now only reports on PLD [ 23–25,50,51 ] as well as mist CVD [ 16,44 ] growth are available. However, these alloys can be grown phase pure in a broad composition range [ 23–25,50 ] of and .…”
Section: Introductionmentioning
confidence: 99%
“…However, these alloys can be grown phase pure in a broad composition range [ 23–25,50 ] of and . The energetic position of the valence band maximum was further found to be independent of the alloy composition, [ 51 ] giving rise to large possible conduction band offsets and widely tunable wavelength ranges in QW heterostructures for QWIP applications ( eV for highest Al and In contents).…”
(AlxGa1−x)2O3 thin‐film layers in the metastable orthorhombic κ‐modification are deposited heteroepitaxially on unintentionally doped ZnO buffer layers on heavily Al‐doped and highly conductive ZnO back contact layers by pulsed laser deposition. The back contact layers potentially serve as electrodes for ferroelectric hysteresis measurements and improve the performance of device applications such as Schottky barrier diodes or quantum‐well infrared photodetectors (QWIPs). The alloy layers cover a broad composition range of 0 ≤ x ≤ 0.48 for which X‐ray diffraction (XRD) patterns confirm the same high crystal quality as for layers grown on single‐crystalline substrates. Epitaxial relations of the κ‐phase layers to the ZnO thin‐film templates are determined and both in‐ and out‐of‐plane lattice constants follow a linear evolution with Al content in agreement with Vegard's law. Smooth surface morphologies are verified in atomic force microscopy images. Finally, a 15‐layer‐pair κ‐(Al0.27Ga0.73)2O3/κ‐Ga2)O3 quantum‐well superlattice (SL) structure is similarly deposited on the ZnO:Al back contact layer and shows sharp SL fringes up to the fifth order in XRD measurements confirming excellent crystal quality and abrupt interfaces in the heterostructure. The results render ZnO:Al as a promising back contact layer for QWIP applications and the determination of electrical polarizations of κ‐phase alloy layers.
The chemical and electronic interactions at metal/oxide heterojunctions is pivotal in determining the electronic properties of oxide devices utilized in microelectronics, catalysis, and photovoltaic systems. In this study, interfacial oxidation migrations within a model heterostructure system, consisting of a La0.7Sr0.3MnO3 film overlaid by various metallic (Ti, Al, Cu, Ag, and Au) ultrathin layers are systematically investigated. It is experimentally demonstrated that at elevated deposition temperature, the oxygen‐active ultrathin overlayers of base metals such as Ti and Al significantly derive oxygen from the underlying La0.7Sr0.3MnO3 film, inducing a perovskite to brownmillerite phase transition in the underlying functional oxide film. Conversely, no structural transitions are observed for La0.7Sr0.3MnO3 film when it is capped by noble metals (Au, Ag), which possess relative high oxidation formation energy. These observations are crucial for the development of novel crystalline and electronic architectures in metal/oxide heterostructures, offering a refined approach to modulate interfacial reactivity without compromising the functionality of oxide‐based heterojunction devices.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.