1994
DOI: 10.1063/1.111178
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Band alignment in GaxIn1−xP/InP heterostructures

Abstract: We report low temperature optical absorption measurements on GaxIn1−xP/InP (x<0.2) multiple quantum wells and strained-layer superlattices. The spectra show several well-defined peaks whose positions can be fitted within an envelope-function formalism including strain effects. We deduce conduction band offsets between the larger gap ternary and smaller gap binary materials ranging from 30 to 50 meV. Since these values are intermediate between the strain-induced shifts for the light- and heavy-hole valen… Show more

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Cited by 17 publications
(7 citation statements)
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“…The conduction band energy of In 0.81 Ga 0.19 P is higher than that of InP and introduces a barrier in the conduction band. This barrier is about 50 meV at 4 K [11] and can be estimated to be close to that value at room temperature using the model-solid theory [12]. The light-hole band gap energy of In 0.81 Ga 0.19 P coherently strained to InP is almost the same as that of InP and the splitting between the light-hole and heavy-hole valence bands is about 100 meV.…”
Section: Introductionsupporting
confidence: 67%
“…The conduction band energy of In 0.81 Ga 0.19 P is higher than that of InP and introduces a barrier in the conduction band. This barrier is about 50 meV at 4 K [11] and can be estimated to be close to that value at room temperature using the model-solid theory [12]. The light-hole band gap energy of In 0.81 Ga 0.19 P coherently strained to InP is almost the same as that of InP and the splitting between the light-hole and heavy-hole valence bands is about 100 meV.…”
Section: Introductionsupporting
confidence: 67%
“…In particular, optical modulators 4 -8 and strained-layer quantum well lasers 9,10 have been demonstrated in this system. Of primary importance in the design of quantum well devices based on these structures are the structural control 2,11 and material parameters, such as band gap and band offset, [12][13][14] which represent the basis of band-gap engineering.…”
Section: Introductionmentioning
confidence: 99%
“…The composite InP/GaInP emitter is doped at a level of 2.5 © 10 16 cm ¹3 , and consists of a 15-nm-thick Ga y In 1¹y P:Si layer and a 5-nm-thick InP:Si layer. [7][8][9] The first 5 nm of the ternary alloy has y = 0.22, which is followed by a grading to y = 0 over 10 nm. The composite emitter is followed by a 130-nm-thick InP:Si emitter layer doped at 1.5 © 10 19 cm ¹3 .…”
mentioning
confidence: 99%