An MOS transistor fabricated on (001) β-Ga 2 O 3 exfoliated from a commercial (−201) β-Ga 2 O 3 substrate is reported. A maximum drain current of 11.1 mA/mm was measured, and a non-destructive breakdown was reached around 80 V in the off state. Threshold voltage of +2.9 V was extracted at 0.1 V drain bias, and peak transconductance of 0.18 mS/mm was measured at V DS = 1 V, corresponding to a field effect mobility of 0.17 cm 2 /Vs. Hall effect and electron spin resonance data suggested that electron conductivity was due primarily to O vacancy donors (V O + ) with an estimated density of 2. The single-crystal monoclinic (β) phase of Ga 2 O 3 is an advantageous material for high-power, high-temperature electronic device applications due to its high energy gap (4.8-4.9 eV) and high breakdown field (8 MV/cm), yielding a nearly ten-fold higher Baliga figure of merit than that of 4H-SiC (BFOM Ga 2 O 3 = 3444, BFOM 4H-SiC = 300).1 Commercially available β-Ga 2 O 3 substrates enable the epitaxial growth of low defect density epitaxial β-Ga 2 O 3 by a number of methods, including chemical vapor deposition, hydride vapor phase epitaxy (HVPE), and molecular beam epitaxy (MBE), among others.2-6 Schottky barrier diodes (SBDs) based on Ga 2 O 3 have exhibited very low turn on voltage and reverse leakage current, suggesting that unintentionally doped Ga 2 O 3 has extremely low generation/recombination rates and thus a high photoconductive gain.7 Advances in doping control have enabled exceptional early reports of metal-and metal-insulatorgated field effect transistors (MOSFETs). Wong et al. demonstrated a field-plated β-Ga 2 O 3 MOSFET with a breakdown voltage of over 750 V using a Si-implanted channel.8 Most recently, Green and coworkers have reported a Ga 2 O 3 MOSFET with a Sn-doped channel and a 0.6 μm gate-drain spacing to operate at 200 V drain bias, experimentally demonstrating gate-drain fields in excess of 3 MV/cm.
9This excellent progress has positioned Ga 2 O 3 as a viable candidate for next generation material for power applications. However, no demonstration of normally-off operation, a key requirement for fail-safe operation of power switches, has been achieved or proposed to-date.From a practical perspective, development of Ga 2 O 3 transistors has been limited by the availability of device-quality epitaxial films. For this reason, early reports have exploited the relatively large a-plane lattice constant of β-Ga 2 O 3 (1.2 nm) in order to mechanically exfoliate thin films from the (001) plane of a substrate using the scotch tape method to fabricate back-gated devices. 10,11 We employed a similar method to transfer a thin (∼300 nm) Ga 2 O 3 flake onto a SiO 2 /Si substrate, 12 and performed a standard top-side insulated-gate process to fabricate a three-terminal device. We also utilized a high-k HfO 2 gate dielectric process, as only SiO 2 and Al 2 O 3 have been reported to-date.
13,14Experimental A thin sliver of Ga 2 O 3 was cleaved along the (001) face of an on-axis (−201), non-intentionally n-type doped (∼3 ×...