Automotive Semiconductor Industry - Trends, Safety and Security Challenges

Ahmad, Afaq

doi:10.1109/icrito48877.2020.9197894

Cited by 19 publications

(12 citation statements)

References 5 publications

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“…Fading industrial boundaries and fundamental changes in traditional technology sectors triggered by technology convergence have led to hyper-coopetition between companies in heterogeneous industries [4,18,42]. Through hyper-coopetition, companies seek external help from other companies with common interests in the market [8,13,15,43].…”

Section: The Rise Of Hyper-coopetition In High-tech Industrymentioning

confidence: 99%

From Coopetition to Hyper-Coopetition: Focusing on a New Paradigm of Heterogeneous Organizational Relationship in the High-Tech Industry

2021

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In this study, we proposed the concept of hyper-coopetition based on an investigation of the inter-organizational relationships of chipmakers. Hyper-coopetition is distinguished from traditional coopetition by having companies in heterogeneous industries as participants, whereas traditional coopetition is a relationship between competitors in the same industry. To investigate antecedents and processes of hyper-coopetition, we established the conceptual framework of hyper-coopetition through a literature review. We conducted a case study on leading chipmakers, including Intel, Samsung, and Nvidia, to investigate antecedents and processes of the chipmakers’ hyper-coopetition. By examining hyper-coopetition, we contributed to the relevant academic field by introducing hyper-coopetition, its typology, and a new research agenda. The analysis result also brought managerial implications for companies in a rapidly changing environment.

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Section: The Rise Of Hyper-coopetition In High-tech Industrymentioning

confidence: 99%

From Coopetition to Hyper-Coopetition: Focusing on a New Paradigm of Heterogeneous Organizational Relationship in the High-Tech Industry

2021

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“…# of specified 1 bits for total # of patterns − # of don ′ t care bits for (2) where W denotes the ratio of the number of specified-1 bits to the total number of specified bits used in a scan cell. If the number of specified bits used in s is zero, then W is zero (Note that (2) is used in Section III-A and III-B).…”

Section: W (S) =mentioning

confidence: 99%

“…First, the list S created in Step 1 is copied to a temporary list labeled Stmp. Second, the weights for all elements of Stmp are calculated using (2). Third, the elements with weights of 0 or 1 are retained and the others are removed from Stmp.…”

Section: B Phase 2: Power-efficient Scan Groupingmentioning

confidence: 99%

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A Low-Power BIST Scheme Using Weight-Aware Scan Grouping and Scheduling for Automotive ICs

Lee

Park

et al. 2021

IEEE Access

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Scan-based logic built-in self-test (LBIST) is widely used for supporting the in-system test in automotive systems. Although this technology has the advantage of low-cost testing, it suffers from low fault coverage and high switching activity during the test. This can lead to many undetected defects, excessive heat dissipation, and IR drop, inducing catastrophic risks to functional safety. Therefore, improving these two key factors is crucial to alleviate reliability problems in the automotive domain. Most previous works have focused on controlling the enormous toggling level of random patterns; however, one of the main disadvantages of these approaches is low fault coverage. Unfortunately, additional hardware costs associated with memory elements or test points are required for detecting the remaining faults. We propose a novel LBIST scheme based on weight-aware scan grouping and scheduling (WGS) to overcome these difficulties. Since the required test time of each automotive product is limited, the proposed scheme freezes the test time and focuses on improving both aforementioned factors significantly. Our approach divides scan cells into two categories: the coverage-efficient scan group and power-efficient scan group, and then it conducts weightbased scan cell reordering. Biased random patterns are fed to enhance fault coverage for the first category. For the second category, scheduling and disabling are performed to reduce switching activity. Finally, physical-aware reordering based on an inverter is performed to reduce routing overhead. Experimental results demonstrate the feasibility of the WGS methodology on the ITC'99 and OpenRISC benchmark circuits.INDEX TERMS Design for testability, low-power testing, scan-based logic BIST, scan cell ordering, scan chain scheduling.

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“…In today's cars more and more functions and tasks are entrusted to electronic components to improve safety, comfort, and entertainment. In the near future, the cost of electronics in a medium-sized vehicle could be 40% of the total cost [1], [2]. The Electronic Control Units (ECUs) are the modules that control these functions (implemented as nodes).…”

Section: Introductionmentioning

confidence: 99%

Supply Line Embedded Communication in Automotive Sensor/Actuator Networks

D'Aniello

Ott

Baschirotto

2021

2021 IEEE International Symposium on Circuits and Systems (ISCAS)

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In recent car developments, the proliferation of Communication systems with several electronics nodes results in increased cost, complexity, and wire harness weight. Such nodes are usually connected by several wires, like a differential communication bus, power supply lines, and possibly addressing lines. In this paper, novel transmitter designs for reducing the amount of interconnects between the nodes are proposed, exploting communication on the power lines, occupying unused parts of the spectrum. Besides the cost-saving, such methods reduce the automotive harness complexity and lead to more flexible solutions, lowering the demand for raw material and consequently reduced emissions during the production process. However, this requires adding specific sections to apply communication to the power line in each IC devices controlling the nodes. In this paper, some 180nm HV-CMOS SOI transmitter solutions are proposed to operate a data rate of up to 2Mbps. Extended simulations in an automotive environment model validate and compare the proposals.

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Automotive Semiconductor Industry - Trends, Safety and Security Challenges

Cited by 19 publications

References 5 publications

From Coopetition to Hyper-Coopetition: Focusing on a New Paradigm of Heterogeneous Organizational Relationship in the High-Tech Industry

From Coopetition to Hyper-Coopetition: Focusing on a New Paradigm of Heterogeneous Organizational Relationship in the High-Tech Industry

A Low-Power BIST Scheme Using Weight-Aware Scan Grouping and Scheduling for Automotive ICs

Supply Line Embedded Communication in Automotive Sensor/Actuator Networks

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