2021 44th International Spring Seminar on Electronics Technology (ISSE) 2021
DOI: 10.1109/isse51996.2021.9467638
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Automatic Evaluation of Flexible Electronic Bending Test

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“…While usually the reliability of electronic devices is verified by electrical characterization, even under conditions of accelerated stress to obtain their lifetime, now it is also essential to carry out a mechanical characterization. In particular, in recent years, the characterization of flexible devices based on the cycles and the radius of bending has become fundamental [264][265][266][267][268] and a few researchers have dedicated themselves to the development of bending test machines [269][270][271][272]. In this regard, the technique of low-frequency noise measurements, previously mentioned as a valid tool for studying the characteristics of materials and devices, has also proven to be a sensitive tool for the characterization of the degradation of electron devices on flexible substrates as a consequence of mechanical stress [272].…”
Section: New Characterization Methodsmentioning
confidence: 99%
“…While usually the reliability of electronic devices is verified by electrical characterization, even under conditions of accelerated stress to obtain their lifetime, now it is also essential to carry out a mechanical characterization. In particular, in recent years, the characterization of flexible devices based on the cycles and the radius of bending has become fundamental [264][265][266][267][268] and a few researchers have dedicated themselves to the development of bending test machines [269][270][271][272]. In this regard, the technique of low-frequency noise measurements, previously mentioned as a valid tool for studying the characteristics of materials and devices, has also proven to be a sensitive tool for the characterization of the degradation of electron devices on flexible substrates as a consequence of mechanical stress [272].…”
Section: New Characterization Methodsmentioning
confidence: 99%