“…In addition, the porous character of our samples, due to the formation of local termination of the 3D network during growth, i.e. CbN bonds, that interrupts the network connectivity (voids), can affect strongly the physicalmechanical properties of the thin films [5,12,19,20]. So, to analyse the correlation between the microstructure evolution under different RF powers and the resulting mechanical properties of our samples, we assume that the deposited a-CN x is composed of a large number of distinct configurations as well as some heterogeneous inclusions and voids.…”