2008
DOI: 10.1149/1.2908201
|View full text |Cite
|
Sign up to set email alerts
|

Atomic Layer Deposition of Silicon Oxide Thin Films by Alternating Exposures to Si[sub 2]Cl[sub 6] and O[sub 3]

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1

Citation Types

3
23
0

Year Published

2012
2012
2022
2022

Publication Types

Select...
7
1

Relationship

0
8

Authors

Journals

citations
Cited by 32 publications
(26 citation statements)
references
References 14 publications
3
23
0
Order By: Relevance
“…As in the previous report, this indicates that a higher growth temperature may lead to the formation of dense SiO 2 films and that this temperature increase correlates with an increase of breakdown strength [21]. Therefore, rapid SiO 2 thin films had excellent breakdown strength (7 MV AE 0.78) even at the low growth temperature (200 8C), compared with that of plasma enhanced ALD SiO 2 films [3,22] (8-10 MV/cm over 300 8C).…”
Section: Resultssupporting
confidence: 71%
“…As in the previous report, this indicates that a higher growth temperature may lead to the formation of dense SiO 2 films and that this temperature increase correlates with an increase of breakdown strength [21]. Therefore, rapid SiO 2 thin films had excellent breakdown strength (7 MV AE 0.78) even at the low growth temperature (200 8C), compared with that of plasma enhanced ALD SiO 2 films [3,22] (8-10 MV/cm over 300 8C).…”
Section: Resultssupporting
confidence: 71%
“…Many ALD processes, with various Si precursors (chlorosilanes or aminosilanes) and oxidants (H 2 O, H 2 O 2 , or O 3 ), were developed for the growth of SiO 2 . Those processes usually require relatively high temperatures (> 150 °C) [1216]. For processes compatible with thermally sensitive materials such as organic, biological, and polymeric materials, the catalyzed ALD [1719] and plasma-enhanced atomic layer deposition (PEALD) [9, 2022] have been used as an effective solution with process temperatures below 100 °C.…”
Section: Introductionmentioning
confidence: 99%
“…Different techniques were used to obtain silica thin films such as plasma-enhanced chemical vapour deposition (PECVD) [4], plasma-assisted reactive magnetron sputtering (PARMS) [5] and atomic layer deposition (ALD) [6]. As flat-plate solar-thermal collectors have polymeric glazing, the high temperature thermal treatment of the thin films does not represent an option.…”
Section: Introductionmentioning
confidence: 99%