Abstract:Atomic layer deposition (ALD) is a self-limited growth method which relies on sequential reactions of gas phase precursor molecules with a solid surface to deposit oxides, metals and other materials in an atomic layer-by-layer fashion. The unique surface-controlled chemistry of ALD enables the conformal coating of high surface area nanoporous materials and provides atomic-level control over the coating thickness. These key advantages offer ALD the ability to precisely tune the pore size and chemical surface co… Show more
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