Articles you may be interested inCharacterization of plasma-enhanced atomic layer deposition of Al2O3 using dimethylaluminum isopropoxide J. Vac. Sci. Technol. A 32, 021514 (2014); 10.1116/1.4866378 Atomic layer deposited (TiO2)x(Al2O3)1−x/In0.53Ga0.47As gate stacks for III-V based metal-oxidesemiconductor field-effect transistor applications Appl. Phys. Lett. 100, 062905 (2012); 10.1063/1.3684803 Al 2 O 3 / NbAlO / Al 2 O 3 sandwich gate dielectric film on InP Appl. Phys. Lett. 96, 022904 (2010);This research focuses on the benefits and properties of TiO 2 -Al 2 O 3 nanostack thin films deposited on Ga 2 O 3 /GaN by plasma-assisted atomic layer deposition (PA-ALD) for gate dielectric development. This combination of materials achieved a high dielectric constant, a low leakage current, and a low interface trap density. Correlations were sought between the films' structure, composition, and electrical properties. The gate dielectrics were approximately 15 nm thick and contained 5.1 nm TiO 2 , 7.1 nm Al 2 O 3 , and 2 nm Ga 2 O 3 as determined by spectroscopic ellipsometry. The interface carbon concentration, as measured by x-ray photoelectron spectroscopy depth profile, was negligible for GaN pretreated by thermal oxidation in O 2 for 30 min at 850 C. The RMS roughness slightly increased after thermal oxidation and remained the same after ALD of the nanostack, as determined by atomic force microscopy. The dielectric constant of TiO 2 -Al 2 O 3 on Ga 2 O 3 /GaN was increased to 12.5 compared to that of pure Al 2 O 3 (8-9) on GaN. In addition, the nanostack's capacitance-voltage (C-V) hysteresis was small, with a total trap density of 8.74 Â 10 11 cm À2 . The gate leakage current density (J ¼ 2.81 Â 10 À8 A/cm 2 ) was low at þ1 V gate bias. These results demonstrate the promising potential of PA-ALD deposited TiO 2 /Al 2 O 3 for serving as the gate dielectric on Ga 2 O 3 /GaN based MOS devices.