2012
DOI: 10.1063/1.3684803
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Atomic layer deposited (TiO2)x(Al2O3)1−x/In0.53Ga0.47As gate stacks for III-V based metal-oxide-semiconductor field-effect transistor applications

Abstract: Atomic layer deposited (ALD) (TiO2)x(Al2O3)1-x(TiAlO) alloy gate dielectrics on In0.47Ga0.53As/InP substrates are shown to produce high quality interfaces between TiAlO and InGaAs. The surface morphology and interfacial reaction of nanolaminate ALD TiAlO on In0.53Ga0.47As are studied using atomic force microscopy and x-ray photoelectron spectroscopy. Measured valence and conduction band offsets are found to be 2.85 ± 0.05 and 1.25 ± 0.05 eV, respectively. Capacitance-voltage characteristics show low frequency … Show more

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Cited by 29 publications
(17 citation statements)
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“…However, chemical shifts at +20.9 and +18.7 eV from the bulk Ga peak were observed; the same type of shift was also observed by Mukherjee et al The two peaks at binding energies 22 and 17 eV were attributed to Ga 2+ and Ga 3+ (Ga 2 O 3 ), respectively . The O 2s XP spectrum (Figure c) peaks at 22.0 and 23.7 eV for Ga–Al–O and Ga–O–Al, respectively, are attributed to the formation of mixed bonding at the interface …”
Section: Results and Discussionsupporting
confidence: 62%
“…However, chemical shifts at +20.9 and +18.7 eV from the bulk Ga peak were observed; the same type of shift was also observed by Mukherjee et al The two peaks at binding energies 22 and 17 eV were attributed to Ga 2+ and Ga 3+ (Ga 2 O 3 ), respectively . The O 2s XP spectrum (Figure c) peaks at 22.0 and 23.7 eV for Ga–Al–O and Ga–O–Al, respectively, are attributed to the formation of mixed bonding at the interface …”
Section: Results and Discussionsupporting
confidence: 62%
“…Such phenomenon has been detected by from Hong et al for ALD-derived HfO 2 on InGaAs. 51 According to the slope of the linear region, the barrier height, Φ B , of 2.35 eV, with respect to the conduction band offset between Al 2 O 3 and InGaAs, has been obtained.…”
Section: Interface Bonding States and Depth Profilementioning
confidence: 99%
“…Thermally grown Ga 2 O 3 on GaN forms a low trap density interface [5][6][7][8] and could thus serve as a good initial layer for GaN MOS devices. Mahata et al 14 In this study, GaN metal oxide semiconductor capacitors (MOSCAPs) were fabricated with atomic layer deposition (ALD) TiO 2 /Al 2 O 3 nanostacks on Ga 2 O 3 as the gate dielectric. 9-11 TiO 2 processes a high dielectric constant [e ¼ 25-80], but it has small bandgap and a small band offset with GaN.…”
Section: Introductionmentioning
confidence: 99%