“…Constructing perfect electron or phonon transfer paths in materials is essential to acquiring desirable EMI SE and TC. Although metallic materials possess high-performance EMI shielding and thermal management capability, their inherent shortcomings of high density, easy corrosion, difficult processing, and inferior flexibility tremendously constrain their practical applications. , Nowadays, conductive polymer composites (CPCs) have attracted considerable attention and have been regarded as prospective alternatives for metallic materials because of their low density, anticorrosion, facile processability, and tunable properties. ,, Nevertheless, realizing high-performance EMI shielding and superior TC for CPCs usually requires high filler loadings, which irreversibly results in a sharp deterioration of the mechanical behavior, an increased thickness, and low affordability. , Numerous studies have certified that combining dielectric and magnetic fillers could synergistically enhance the attenuation capacity of electromagnetic waves (EMW) owing to the electromagnetic double dissipation effect. − Although the electric/magnetic hybrid CPCs can significantly enhance EMI SE, it still is a daunting task to obtain high EMI shielding performance with superior EMW absorption because the regulation of impedance matching is difficult in a homogeneous structure with constant conductivity. ,, Consequently, developing CPCs with high-efficiency EMI SE entailing strong EMW absorption remains challenging.…”