2009
DOI: 10.1088/0268-1242/24/4/045001
|View full text |Cite
|
Sign up to set email alerts
|

Asymmetric 3D tri-gate 4H-SiC MESFETs with a recessed drain drift region

Abstract: An improved asymmetric 3D tri-gate 4H-SiC metal-semiconductor field effect transistor with a recessed drain drift region was proposed in order to improve the power and frequency performance of the device. The dc and RF electrical characteristics of the proposed structure were studied in detail by numerical simulation. The simulated results showed that the maximum theoretical output power density of the proposed structure is about 36% larger than that of the published symmetric 3D tri-gate structure due to sign… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2011
2011
2021
2021

Publication Types

Select...
6

Relationship

1
5

Authors

Journals

citations
Cited by 13 publications
(1 citation statement)
references
References 12 publications
0
1
0
Order By: Relevance
“…To simplify the simulation, the cell marked within the red dash line for the two structures are simulated. Similar to our previous work in [3], [6], [21], [30] and [36], Fermi-Dirac statistics is used in the simulation and models, such as band gap narrowing (BGN), incomplete ionization, FLDMOB, CONWELL, SURFMOB, CONSRH, Auger and analytic models are considered. 4H-SiC material is used and the main device parameters used in the simulation are listed in the Table 1.…”
Section: Device Structure and Mechanismmentioning
confidence: 99%
“…To simplify the simulation, the cell marked within the red dash line for the two structures are simulated. Similar to our previous work in [3], [6], [21], [30] and [36], Fermi-Dirac statistics is used in the simulation and models, such as band gap narrowing (BGN), incomplete ionization, FLDMOB, CONWELL, SURFMOB, CONSRH, Auger and analytic models are considered. 4H-SiC material is used and the main device parameters used in the simulation are listed in the Table 1.…”
Section: Device Structure and Mechanismmentioning
confidence: 99%