Assembly technology development and failure analysis for three-dimensional integrated circuit integration with ultra-thin chip stacking

Lee, Chang‐Chun; Lin, Yu-Min; Hsieh, Chih-Jen; Liou, Yan-Yu; Zhan, Cheng; Chang, Tao-Chih; Wang, Chien‐Ping

doi:10.1016/j.mee.2016.01.040

Cited by 6 publications

(1 citation statement)

References 15 publications

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“…The reliability has not been fully studied and guaranteed [12]. Identifying defects and analyzing the failure mechanism play important roles in the optimization and improvement of the design, production, and use of TSV 3D integrated devices [13][14][15][16][17][18][19].…”

Section: Introductionmentioning

confidence: 99%

Boundary Layers Defect Diagnosis and Analysis of Through Silicon Via (TSV)

Yuan¹,

Zhang²,

Xia³

et al. 2019

IJPE

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TSV technology can achieve heterogeneous integration by stacking different technologies and functions of logic chip, memory, MEMS, etc., as a system. There are many significant advantages for heterogeneous integration in terms of cost, performance, and time to market. TSV technology has the potential to improve 3D packaging. As the important physical connection and electrical connection between the chips, TSV's reliability is undoubtedly the key to determine the reliability of TSV three-dimensional integrated devices. As a new interconnect technology, TSV technology faces many process difficulties and challenges. Its reliability has not been fully studied and guaranteed. The process optimization and reliability improvement of TSV have become a hot topic in recent years. Recognition process defects and analysis of the failure mechanism play important roles in the optimization and improvement of design, production, and use of TSV three-dimensional integrated devices. In this paper, the square TSV and circular TSV with different ratios were researched by microphysical analysis and data analysis. The analysis results revealed the key technological factors and physical mechanism of formation of the TSV defects, which can support TSV device development, production, and reliable application.

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