Assembly of a 3D Cellular Computer Using Folded E-Blocks

Abstract

The assembly of integrated circuits in three dimensions (3D) provides a possible solution to address the ever-increasing demands of modern day electronic devices. It has been suggested that by using the third dimension, devices with high density, defect tolerance, short interconnects and small overall form factors could be created. However, apart from pseudo 3D architecture, such as monolithic integration, die, or wafer stacking, the creation of paradigms to integrate electronic low-complexity cellular building blocks in architecture that has tile space in all three dimensions has remained elusive. Here, we present software and hardware foundations for a truly 3D cellular computational devices that could be realized in practice. The computing architecture relies on the scalable, self-configurable and defect-tolerant cell matrix. The hardware is based on a scalable and manufacturable approach for 3D assembly using folded polyhedral electronic blocks (E-blocks). We created monomers, dimers and 2 × 2 × 2 assemblies of polyhedral E-blocks and verified the computational capabilities by implementing simple logic functions. We further show that 63.2% more compact 3D circuits can be obtained with our design automation tools compared to a 2D architecture. Our results provide a proof-of-concept for a scalable and manufacture-ready process for constructing massive-scale 3D computational devices.

Self‐Folding Using Capillary Forces

“…Also, solidification of liquid hinges composed of solder or polymers on cooling allow such self‐folded polyhedra to be permanently bonded and sealed in‐place. Consequently, such polyhedra could be used as building blocks for aggregative assembly of 3D metamaterials (Figure b), 3D electrical networks, (Figure c) and 3D computational devices, which is not presently possible by other approaches. Also, as previously mentioned, it would be interesting to manipulate surface properties or surface tension to create dynamic and reversible structures.…”

Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving, and Buckling Approaches

“…Besides, the spherical geometry allows the acceptance of light from all spatial directions. Figure a (iii) shows a polyhedral electronic block integrated with a variety of electronic modules, such as transistors and chips . Simulation results showed that the compactness of 3D architectures is 63.2% better than the 2D layouts.…”

“…(iii) The required cell number of 3D integrated gates in comparison with the 2D layout at the same performance level. Adapted under the terms of the CC‐BY 4.0 Creative Commons Attribution License . Copyright 2016, The Authors, published by MDPI.…”

“…Copyright 2013, Wiley‐VCH. Adapted under the terms of the CC‐BY 4.0 Creative Commons Attribution License . Copyright 2016, The Authors, published by MDPI.…”

Origami and Kirigami Nanocomposites

“…Such devices enable wide-angle steering of optical beams and simplify engineering embodiments, providing advanced building blocks for light detection and ranging (LIDAR), spectroscopy, and other technologies. Other electronic or optical devices, including tunable inductors and antennas, optical metamaterials, and 3D wiring of electronic components, are also achievable though origami and kirigami routes.…”