Assembly challenges related to fine pitch in-line and staggered bond pad devices

Ruston, M.; Tran, Tu Anh; Yong, Lois; Youngblood, Allison; Ravenscraft, D.; Harun, Fuaida; Mui, Kok Wai

doi:10.1109/ectc.2003.1216468

Cited by 3 publications

(3 citation statements)

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“…When the ball bond diameter decreased 14 per cent from 70 μ m to 60 μ m, the average ball shear strength decreased 29 per cent from 35 to 25 gf. When the ball bond diameter decreased 42 per cent from 60 μ m to 35 μ m, the average ball shear strength decreased 63 per cent from 25 to 9.2 gf, although the ball shear strength per unit area was maintained above the minimum industry‐standard value of 5.5 gf/mi1 2 (Ruston et al , 2003).…”

Section: Challenges In Fine and Ultra‐fine Pitch Wire Bondingmentioning

confidence: 99%

“…Stable ball shear performance (above 5.5 gf/mi1 2 ) after 750 hours thermal aging could be achieved by wire bonding on un‐probed pads, not on the probed pads. Clean un‐probed bond pads are increasingly critical to reliable and small ball bond formation (Ruston et al , 2003). A unique bond pad structure was also proposed to create separate regions for probing and wire bonding without increasing the die size.…”

Section: Solutions and Findings For Reliable Fine And Ultra‐fine Pitch Wire Bondingmentioning

confidence: 99%

“…The bond pad layout (in‐line or staggered) and the pad dimension significantly affect the number of bond pads and the die size required. A staggered pad layout is recommended for devices with a high number of pads and a small core area; otherwise an in‐line pad layout is recommended (Ruston et al , 2003).…”

Section: Solutions and Findings For Reliable Fine And Ultra‐fine Pitch Wire Bondingmentioning

confidence: 99%

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Fine and ultra‐fine pitch wire bonding: challenges and solutions

Zhong

2009

Microelectronics International

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PurposeThe purpose of this paper is to review recent advances in fine and ultra‐fine pitch wire bonding.Design/methodology/approachDozens of journal and conference articles published recently are reviewed.FindingsThe problems/challenges such as possible wire sweep and decreased bonding strength due to small wire sizes, non‐sticking, metal pad peeling, narrow process windows, wire open and short tail defects are analysed. The solutions to the problems and recent findings/developments in fine and ultra‐fine pitch wire bonding are discussed.Research limitations/implicationsBecause of the page limitation, only brief discussions are given in this paper. Further reading is needed for more details.Originality/valueThis paper attempts to provide an introduction to recent developments and the trends in fine and ultra‐fine pitch wire bonding. With the references provided, readers may explore more deeply by reading the original articles.

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Section: Challenges In Fine and Ultra‐fine Pitch Wire Bondingmentioning

confidence: 99%

Section: Solutions and Findings For Reliable Fine And Ultra‐fine Pitch Wire Bondingmentioning

confidence: 99%

Section: Solutions and Findings For Reliable Fine And Ultra‐fine Pitch Wire Bondingmentioning

confidence: 99%

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