“…A summary of the field‐effect electron mobility values reported in recent years for different metal oxide heterointerface systems grown by different methods (e.g., sputtering, molecular beam epitaxy (MBE), metalorganic chemical vapor deposition (MOCVD), and atomic layer deposition (ALD) techniques) is given in Table S1 (Supporting Information). Despite these very promising early results and the tremendous potential of the 2DEG transistor technology, however, its widespread adoption in practical electronic applications is currently hampered by the rather complex23 and high temperature (600–900 °C, see Table S1, Supporting Information) manufacturing processes often required in order to ensure the formation of the all‐important high‐quality heterointerface 19, 24, 25. Because of the latter requirement it is not a trivial question whether high‐quality oxide heterointerfaces can be realized using simpler, cost‐efficient, and high‐throughput fabrication methods that are compatible with existing semiconductor fabrication processes (e.g., solution‐based) and even perhaps temperature‐sensitive substrate materials such as plastic.…”