Applications of TiAl-based intermetallic compound.

Hino, Haruki; Miyashita, Tetsuya; Minakata, Syun-ichi

doi:10.2464/jilm.43.545

Cited by 5 publications

(1 citation statement)

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“…Attention has been paid to TiAl intermetallic compound (TiAl, hereinafter) since it can be used as aerospace materials etc., [1][2][3][4][5][6] especially at high temperatures. The specific gravity of TiAl (ca.…”

Section: Introductionmentioning

confidence: 99%

Tensile Properties of Diffusion Bonds between TiAl Intermetallic Compound and Titanium Alloy

2005

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To investigate the feasibility of joining the TiAl intermetallic compound to titanium alloys, the diffusion bonding of TiAl to Ti-17 alloys (Ti-Al-Cr-Mo-Sn-Zr, near -phase alloy) was performed, and the effects of joining parameters on the joint strength and the diffusion phase at the bonding interface were examined.The major results are as follows:(1) For diffusion bonding of TiAl to Ti-17, joints which fractured at the TiAl base metal on the tensile test were obtained in case where the thickness of the diffusion phase at the bonding interface exceeded 10 mm. (2) The observation of the diffusion phase revealed that a solid solution of TiAl matrix containing the alloying elements of Ti-17 such as Cr, Mo, Zr and Sn, and a small amount of Ti 3 Al particles were formed, while no lamellar Ti 3 Al detrimental to the joint strength was detected. This result can be interpreted by taking into account the effects of Cr and Mo on the Ti-Al phase diagram. (3) The bonding temperature to give the maximum tensile strength of the TiAl to Ti-17 joint was found to be higher than those of TiAl to pure titanium joint and TiAl to Ti-6Al-4V alloy joint.

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Section: Introductionmentioning

confidence: 99%

Tensile Properties of Diffusion Bonds between TiAl Intermetallic Compound and Titanium Alloy

2005

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Study of the Quenched Defects in TiAl Alloy by Positron Annihilation

Wang

Zhang

Wang

et al. 1997

phys. stat. sol. (a)

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The recovery behavior of quenched‐in defects in TiAl alloys was studied by positron annihilation lifetime measurements. The results indicate that there is a certain number of grain boundaries in fully annealed TiAl samples, and after being quenched, the samples contain quite a lot of secondary defects such as vacancy clusters besides a large amount of mono‐vacancies. The vacancy clusters aggregate further in the temperature range from 300 to 600 °C due to the impurity atoms.

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