Applications of SOI-based optical MEMS

Noell, Wilfried; Clerc, P.-A.; Dellmann, L.; Guldimann, Benedikt; Herzig, Hans Peter; Manzardo, O.; Marxer, C.; Weible, K. J.; Dändliker, R.; Rooij, Nico de

doi:10.1109/2944.991410

Cited by 118 publications

(64 citation statements)

References 17 publications

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“…Again, flip-chip assembly was chosen for an optical fiber cross connect with MEMS switches [26] and integrated waveguides [27]. In addition, the faces of the waveguides can be given an optical shape.…”

Section: Optical Cross Connect With Linear Motion Actuated By Electromentioning

confidence: 99%

Modular Microoptical Systems for Sensors and Telecommunication

Wallrabe

Mohr

2003

Sensors Update

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This paper focuses on fabrication and assembly processes of modular and hybrid microoptical systems in use in sensor and telecommunication fields. These microoptical systems are made by a huge variety of processes, which are commonly known as microsystem technology. Nevertheless, quite a lot of them are based on the LIGA process, since LIGA is an "assembly friendly" technology.Modular microoptical systems typically comprise several functions incorporating mechanical or electromechanical components beside the optical elements. The assembly of the diverse submounts and components is performed actively as well as passively. In many cases, all of these functions can be combined on one single chip. In several cases, however, a pair of chips, which is assembled in a flip-chip like way, is used.The framework of the paper leads to a definition of the terminus "modular microoptical system" and argues for the advantages of such a modular design approach. It closes with some remarks on automatic assembly strategies.

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Section: Optical Cross Connect With Linear Motion Actuated By Electromentioning

confidence: 99%

Modular Microoptical Systems for Sensors and Telecommunication

Wallrabe

Mohr

2003

Sensors Update

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“…Due to the high-aspect ratio achievable by DRIE, many types of high-performance actuators have been developed and demonstrated with in-plane motion. Actuation from electrostatic comb drives (e.g., [10], [12]), gap-closing actuators (e.g., [21]) or thermal actuators have been demonstrated. More complex designs were developed to provide large in-plane displacements and 2-D in-plane displacements [21].…”

Section: Multilevel Beams In Soi Device Layermentioning

confidence: 99%

Multilevel beam SOI-MEMS fabrication and applications

Milanović

9th International Conference on Electronics, Circuits and Systems

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Abstract-A microfabrication technology has been developed and demonstrated, which enhances the capabilities and applications of high aspect ratio silicon-on-insulator microelectromechanical systems (SOI-MEMS) by enabling additional independent degrees of freedom of operation: both upward and downward vertical pistoning motion as well as bi-directional rotation. This is accomplished by applying multiple-mask high aspect ratio etches from both the front-and back-side of the SOI device layer, forming beams at different levels. The processes utilize four masks, two for front-side and two for back-side etching. As a result, single-crystal silicon beams with four different cross-sections are fabricated, and can be combined to form many additional beam cross-sections. This provides a wide variety of possible mechanical designs that can be optimized for optical and other applications. By this methodology, unique high aspect ratio micromirror devices were demonstrated with fully isolated and accurately self-aligned vertical combdrives in the SOI device layer, with initial combfinger overlap. Examples of fabricated devices are shown with performance summaries.[886]Index Terms-Deep reactive ion etch (DRIE), inductively coupled plasma (ICP) etch, microfabrication, micromirrors, optical MEMS, self-alignment, SOI-MEMS, vertical combdrives.

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“…By scaling down from a macro-scale to a micro-scale, the mass of structures (m ∼ r 3 ) decreases more rapidly than the stiffness (k ∼ r), which inherently means a higher eigenfrequency (f 0 ∼ k/m ∼ 1/r) and a faster response time. This opens up a range of interesting applications for MEMS-based positioning stages, for example integrated optical components [97], probe-based data storage systems [36], and sample or beam manipulators for use in electron microscopes [25,94,133]. In a broad perspective, the work on small manipulators can serve as an enabling technology for new applications when it is available.…”

Section: Introductionmentioning

confidence: 99%

“…Positioning stages in MEMS can be used in a variety of applications, such as probe based data storage systems [36], integrated optical components [97], and sample positioners or manipulators in electron microscopes [25,94,133]. Since friction effects have a large influence on the micro scale, typical existing multi degreeof-freedom (DOF) positioning stages in MEMS are based on compliant flexure mechanisms.…”

Section: Introductionmentioning

confidence: 99%

A large-stroke planar MEMS-based stage with integrated feedback

Krijnen¹

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Applications of SOI-based optical MEMS

Cited by 118 publications

References 17 publications

Modular Microoptical Systems for Sensors and Telecommunication

Modular Microoptical Systems for Sensors and Telecommunication

Multilevel beam SOI-MEMS fabrication and applications

A large-stroke planar MEMS-based stage with integrated feedback

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