Applications of nuclear microprobes to semiconductor process developments

Takai, M.

doi:10.1016/0168-583x(95)00392-4

Cited by 9 publications

(1 citation statement)

References 15 publications

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“…The development of semiconductor chips for high voltage control and high-speed wireless communications is progressing, miniaturization of the package substrates contained in semiconductor chips is also required by industry [1][2][3][4]. These packages are usually manufactured using a low-temperature co-fired ceramic (LTCC) technology [5,6], the sintering temperature of which is approximately 1000°C due to the use of glass for the substrates.…”

Section: Introductionmentioning

confidence: 99%

Investigation of the effects of silica coating on the thermal conductivity and porosity of aluminum nitride after sintering

Kita

Kondo

2019

Journal of Asian Ceramic Societies

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This paper describes a method of applying a silica coating on aluminum nitride and investigations concerning the thermal conductivity between the coating layer and the aluminum nitride as well as the effect of the silica coating layer on the density of samples containing aluminum nitride and glass after sintering. The coating was carried out using polycarbosilane that was transformed into silica by pyrolysis under an airflow. The measured thermal conductivities of all the samples were within an error of less than 10 W/m•K. The porosity of a sintered sample containing the silica-coated aluminum nitride powder and glass powder was decreased by about 10% compared to that of a sintered sample comprising pure aluminum nitride powder.

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