2019
DOI: 10.3390/ma12203411
|View full text |Cite
|
Sign up to set email alerts
|

Application of Two-Photon-Absorption Pulsed Laser for Single-Event-Effects Sensitivity Mapping Technology

Abstract: Single-event effects (SEEs) in integrated circuits and devices can be studied by utilizing ultra-fast pulsed laser system through Two Photon Absorption process. This paper presents technical ways to characterize key factors for laser based SEEs mapping testing system: output power from laser source, spot size focused by objective lens, opening window of Pockels cell, and calibration of injected laser energy. The laser based SEEs mapping testing system can work in a stable and controllable status by applying th… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2

Citation Types

0
5
0

Year Published

2020
2020
2024
2024

Publication Types

Select...
6
1

Relationship

1
6

Authors

Journals

citations
Cited by 8 publications
(5 citation statements)
references
References 31 publications
(41 reference statements)
0
5
0
Order By: Relevance
“…There are two typical laser SEEs testing processes, single photon absorption (SPA) and two photon absorption (TPA), which are described in detail by several studies [5][6][7]. Due to the presence of metal layers on the top surface of most IC components, ultra-fast laser pulses are typically injected from the bottom side (i.e., the substrate side) and extra charges would be generated in desired areas by the TPA mechanism.…”
Section: Introductionmentioning
confidence: 99%
See 3 more Smart Citations
“…There are two typical laser SEEs testing processes, single photon absorption (SPA) and two photon absorption (TPA), which are described in detail by several studies [5][6][7]. Due to the presence of metal layers on the top surface of most IC components, ultra-fast laser pulses are typically injected from the bottom side (i.e., the substrate side) and extra charges would be generated in desired areas by the TPA mechanism.…”
Section: Introductionmentioning
confidence: 99%
“…Due to the presence of metal layers on the top surface of most IC components, ultra-fast laser pulses are typically injected from the bottom side (i.e., the substrate side) and extra charges would be generated in desired areas by the TPA mechanism. With specifics of laser source, an approximate value of the number of generated charges can be calculated by a deduced equation [7], which is a benefit for SEE laser testing.…”
Section: Introductionmentioning
confidence: 99%
See 2 more Smart Citations
“…Other complementary methods use pulsed-laser or X-ray based radiation that are almost exclusively focused to point-like beams, then scanned across a device to identify the regions that generate the highest number of upsets. [11][12][13] Another approach is to simulate fault injection to observe how a device responds when a certain, known component is corrupted. 14,15 These techniques significantly speed up the characterization process.…”
mentioning
confidence: 99%