Application of sputtered layers in contact technology

Abstract

PVD layers are investigated under simulated operation conditions for their suitability as connector and switch contact materials. The tribological properties import for connector contact materials like e. g. wear, fretting etc. of sputtered base metal containing silver alloys (AgSn) and of electroplated standard materials (Ag, Sn) are investigated. Positive results are obtained with sputtered AgSnlayers regarding wear and fretting. Aubased PVD layers are tested for their static and dynamic contact behaviour in switching applications. Comparison is made with roller clad standard alloys Au8Ag and AuSNi. The influence of the surface topography of PVD layers on the switching behaviour is being discussed. The static and dynamic contact behaviour of PVD layers with optimized surface topography surpasses that of the standard. Production techniques for connectors and switch contact materials are demonstrated.

Design and fabrication of a highly manufacturable MEMS probe card for high speed testing

“…Ag 3 Sn 96.5 Cu 0.5 and Au 80 Sn 20 solder bonding Generally, a strong mechanical joint is required to guarantee stable electrical interconnection between the top and bottom materials during the assembly as well as in the period of field operation. Therefore, a eutectic solder of lead-tin, silvertin, silver-tin-copper and a gold-tin is commonly used for soldering of microsystems such as optoelectronic, RF and MEMS packaging [17][18][19][20][21][22][23][24][25]. There have been several research studies on AgSn, AgSnCu, AuSn such as Ag-Sn electroplating (Ag-Sn meaning AgSn alloy), Ag/Sn electroplating (Ag/Sn meaning Sn electroplating on Ag electroplating), Ag/Sn evaporation, Ag-Sn-Cu paste, Au-Sn electroplating, Au/Sn plating and Au/Sn evaporation.…”