Application of Shadow Moir~ Technique to Board Level Manufacturing Technologies

Geng, P.; Bandorawalla, T.; Cho, S.; Hsiao, Hsiang Yao; Kuchy, J.; Long, Gary; Martinson, R.; McAllister, Alan; Mello, M.; Meyyappan, Karumbu; Williams, R F; Zhu, Lijun

doi:10.1109/ectc.2006.1645906

Cited by 5 publications

(2 citation statements)

References 7 publications

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“…For that a fringe pattern is situated a few millimetres above the sample. The generated pattern is developed by the interference between the lines on the grating and shadow lines in the measured sample [8].…”

Section: Measurement Principlementioning

confidence: 99%

Improving the FE simulation of molded packages using warpage measurements

Huber

Dijk

Walter

et al. 2014

Microelectronics Reliability

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Section: Measurement Principlementioning

confidence: 99%

Improving the FE simulation of molded packages using warpage measurements

Huber

Dijk

Walter

et al. 2014

Microelectronics Reliability

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“…The shadow moiré method is a well known and widely used measurement method used for shape and out-of-plane deformation measurement, such as the measurement of warpage in a printed circuit board [7,8]. The measurement range and sensitivity can be easily controlled because these depend on the resolution of the grating used.…”

Section: Introductionmentioning

confidence: 99%

Deflection Measurement and Determination of Young’s Modulus of Micro-cantilever Using Phase-shift Shadow Moiré Method

et al. 2009

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The deflection of micro-structures have been previously measured using optical interferometry methods. In this study, the classical phase-shift shadow moiré method (PSSM) was applied to measure the deflection of a silicon micro-cantilever and to determine the Young's modulus of the cantilever material. The modulus value was determined from the profile based on deflection equation. A normal white light source and a grating of 40 line pairs per mm were used to generate the moiré fringes. Since the use of white light and high-resolution grating produces low contrast moiré fringes, the fringe visibility was enhanced by applying contrast enhancement and filtering techniques. The Young's modulus of the silicon cantilever material was estimated to be 165.9 GPa with an uncertainty of ±11.3 GPa (6.8%). The experimental results show that the PSSM method can be successfully applied for characterizing micro-cantilevers. Comparison of the deflection profile from the proposed method and a commercial 3-D optical profiler showed that the measurement range and sensitivity of PSSM are not affected by the poor contrast images.

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Warpage measurement of substrates and printed circuit boards with Shadow Moiré

Huang

Zhu

et al. 2021

2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

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Application of Shadow Moir~ Technique to Board Level Manufacturing Technologies

Cited by 5 publications

References 7 publications

Improving the FE simulation of molded packages using warpage measurements

Improving the FE simulation of molded packages using warpage measurements

Deflection Measurement and Determination of Young’s Modulus of Micro-cantilever Using Phase-shift Shadow Moiré Method

Warpage measurement of substrates and printed circuit boards with Shadow Moiré

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