Application of holography to evaluate the thermal deformation of printed circuit board connector due to thermal stress

Taniguchi, Masanari; Takagi, Tasuku

doi:10.1109/iemt.1999.804833

Cited by 3 publications

(1 citation statement)

References 6 publications

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“…If the hologram contains more than two images and the phase between reconstructed images changes because of deformations or for any other reason, a fringe pattern will be generated corresponding to the phase change. This fringe pattern is used to measure deformations (Taniguchi and Takagi 1999), vibration (Stetson and Powell 1965), residual stress (Sanchez and Hornberger 2002), thickness change of the surface layer (Habib 2001), and defects (Rastogi 1985).…”

Section: Introductionmentioning

confidence: 99%

Effect of thermal deformations of an optical pick-up base on the optical properties of DVD optical system

2005

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An analytical method is presented to analyze the effect of thermal deformations of an optical pickup base on the optical properties of DVD optical system. To measure the amount of thermal deformations of an optical pick-up base, finite element analysis and holographic interferometry were used. First, thermal deformations of an aluminum pick-up base was analyzed in thermal environments using finite element analysis; finite element analysis was carried out without the initial surface stress condition. The measurement of thermal deformations by holographic interferometry was carried out to verify finite element analysis results. However, since the finite element analysis results were deviated from those by experiment, the effect of the initial surface stress condition was considered; finite element analysis was carried out with the initial surface residual stress condition, which was obtained from X-ray diffraction measurement. The finite element analysis results with the initial surface stress condition agreed well with the experimental results by holographic interferometry. Finally, to analyze the effect of thermal deformations of the pick-up base on the optical properties of DVD optical system, the deformation of optical path was analyzed. However, the drastic changes of beam spot, beam intensity profile, modulation transfer function curve and wavefront aberration were not observed.

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Section: Introductionmentioning

confidence: 99%

Effect of thermal deformations of an optical pick-up base on the optical properties of DVD optical system

2005

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A Study for Corrosion and False Soldering Failures of Printed Circuit Board Connectors

Zhu

et al. 2020

2020 21st International Conference on Electronic Packaging Technology (ICEPT)

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Measurement of microthermal deformations in an optical pick-up base using holographic interferometry

Seo

2003

Opt. Eng

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Application of holography to evaluate the thermal deformation of printed circuit board connector due to thermal stress

Cited by 3 publications

References 6 publications

Effect of thermal deformations of an optical pick-up base on the optical properties of DVD optical system

Effect of thermal deformations of an optical pick-up base on the optical properties of DVD optical system

A Study for Corrosion and False Soldering Failures of Printed Circuit Board Connectors

Measurement of microthermal deformations in an optical pick-up base using holographic interferometry

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