Application of Confocal Microscopy Methods for Research and Non-destructive Examination of Semiconductor Structures and Integrated Circuits

Baluev, Arseniy A.; Ukolov, D. S.; Pechenkin, Alexander; Mozhaev, R. K.

doi:10.1109/miel52794.2021.9569106

Cited by 3 publications

(1 citation statement)

References 7 publications

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“…Keywords: machine vision, laser scanning microscopy, topology correction, microelectronics, laser scribing, automation. Машинное зрение и лазерная сканирующая микроскопия (ЛСМ) [1][2][3] находят применение в определении и контроле доверенности изделий электронной компонентной базы (ЭКБ). Доверенность ЭКБ подразумевает соответствие изделия требованиям к функционально-техническим, эксплуатационным характеристикам и предъявляемым требованиям по технологической, функциональной и информационной безопасности.…”

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Application of machine vision technology for focused laser effect accuracy improvement in microelectronic structures research and semiconductor microprocessing

Mozhaev,

Pechenkin,

Tsirkov

et al. 2023

BIT

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Application of machine vision technology for focused laser effect accuracy improvement in microelectronic structures research and semiconductor microprocessing

Mozhaev,

Pechenkin,

Tsirkov

et al. 2023

BIT

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Laser scanning confocal IR microscopy for non-destructive testing of semiconductors

Ukolov

Baluev

Gromova

et al. 2022

2022 Moscow Workshop on Electronic and Networking Technologies (MWENT)

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High-precision surface profilometry on a micron-groove based on dual-comb electronically controlled optical sampling

Wu,

Li,

Xue

et al. 2023

Appl. Opt.

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We demonstrate an optical method for 3D profilometry of micro-nano devices with large step structures. The measurement principle is based on a dual-comb direct time-of-flight detection. An electronically controlled optical sampling (ECOPS) approach is used to improve the acquisition rate. In a proof-of-principle distance measurement experiment, the measurement precision reaches 15 nm at 4000-times averages. The method has been used to characterize the profile of a large aspect-ratio rectangular micron-groove with 10 µm width and 62.3 µm depth. By point-by-point scanning, a 3D point cloud image is obtained, and the 3D profile of the micro-structure is quantitatively reconstructed with sub-micrometer precision. The proposed high-precision, high-speed surface 3D profile measurement technology could be applied to profilometry and inspection of complex microelectronics devices in the future.

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Application of Confocal Microscopy Methods for Research and Non-destructive Examination of Semiconductor Structures and Integrated Circuits

Cited by 3 publications

References 7 publications

Application of machine vision technology for focused laser effect accuracy improvement in microelectronic structures research and semiconductor microprocessing

Application of machine vision technology for focused laser effect accuracy improvement in microelectronic structures research and semiconductor microprocessing

Laser scanning confocal IR microscopy for non-destructive testing of semiconductors

High-precision surface profilometry on a micron-groove based on dual-comb electronically controlled optical sampling

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