ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)
DOI: 10.1109/itherm.2002.1012515
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Apparatus for accurate measurement of interface resistance of high performance thermal interface materials

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Cited by 19 publications
(15 citation statements)
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“…This helps to minimize the uncertainty of the two driving quantities that affect the accuracy of the overall results, namely the temperature measurements and the locations of these measurements. As in previous investigations [3,4], numerical simulations demonstrated the influence of the intruding thermistors had negligible impact on the temperature profile through the meter bars, the associated heat fluxes and the temperature distributions at the contact surface.…”
Section: Meter Bars and Thermometrysupporting
confidence: 69%
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“…This helps to minimize the uncertainty of the two driving quantities that affect the accuracy of the overall results, namely the temperature measurements and the locations of these measurements. As in previous investigations [3,4], numerical simulations demonstrated the influence of the intruding thermistors had negligible impact on the temperature profile through the meter bars, the associated heat fluxes and the temperature distributions at the contact surface.…”
Section: Meter Bars and Thermometrysupporting
confidence: 69%
“…This configuration relies on highlyconductive and well-characterized meter bars to both extrapolate the temperature at the surfaces and measure the heat flow through the sample. A number of studies have made use of this general design [3][4][5][6][7] Gwinn et al [4] developed an apparatus for testing TIMs capable of measuring thermal impedances as low as 6.5 × 10-6 m2•K/W with an uncertainty of 10%. The copper meter bars were 38.1 mm square in cross-section and 45 mm long, instrumented with three 1.59 mm RTDs, with the closest RTD located 2 mm from the surface.…”
Section: Introductionmentioning
confidence: 99%
“…As an example, it has been reported [64] that for a Pentium 2 processor, the TIM accounted for 15% of the total allowable thermal resistance and if the same TIM had been used for a Pentium 4, with 6.1% increase in heat flux, then the TIM would have used 80% of the thermal budget. And, as it is clear increase in power dissipation is a trend that is set to continue and as such there is going to be a need for thermal interface materials with higher performance, lowest thermal resistance and long term reliability.…”
Section: Discussionmentioning
confidence: 99%
“…The uncertainty in measuring thermal resistance is inversely related to the resistance value [28]. A lower resistance value results in a higher uncertainty.…”
Section: Uncertainty Analysismentioning
confidence: 99%