Advances in Resist Materials and Processing Technology XXV 2008
DOI: 10.1117/12.772827
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Anti-reflective coating for multipatterning lithography

Abstract: New bottom anti-reflective coatings (BARCs) have been developed that can be incorporated into multiple patterning schemes utilizing scanner-track-only processes. The BARCs have modifiable optical properties and can be removed during the resist development step. Several dual patterning schemes were investigated for trench printing. The most promising process produced 110 nm trenches with approximately 1:1 space ratios. The etch characteristics of these BARCs under fluorinated and oxygenated gases were determine… Show more

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Cited by 2 publications
(1 citation statement)
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“…Choi et al 56 from Massachusetts Institute of Technology, USA, presented and experimentally demonstrated a novel method of multiple shrinking mask etching to fabricate silica nanocone arrays with ultra-high aspect ratio of about 7 for multifunctional surfaces having excellent self-cleaning, anti-fogging, and anti-reflective properties. Guerrero et al 57 developed a new bottom anti-reflective coating that can be incorporated into multipatterning lithography schemes by using scanner track–only processing, and the most promising anti-reflective process produced 110-nm-deep trenches with approximately 1:1 space ratio. Kettle et al 58 from the United Kingdom fabricated anti-reflective structures with reflectivity below 6% by using a low-temperature thermal nanoimprint lithography for low band gap flexible organic solar cells.…”
Section: Worldwide Research Status Outside Chinamentioning
confidence: 99%
“…Choi et al 56 from Massachusetts Institute of Technology, USA, presented and experimentally demonstrated a novel method of multiple shrinking mask etching to fabricate silica nanocone arrays with ultra-high aspect ratio of about 7 for multifunctional surfaces having excellent self-cleaning, anti-fogging, and anti-reflective properties. Guerrero et al 57 developed a new bottom anti-reflective coating that can be incorporated into multipatterning lithography schemes by using scanner track–only processing, and the most promising anti-reflective process produced 110-nm-deep trenches with approximately 1:1 space ratio. Kettle et al 58 from the United Kingdom fabricated anti-reflective structures with reflectivity below 6% by using a low-temperature thermal nanoimprint lithography for low band gap flexible organic solar cells.…”
Section: Worldwide Research Status Outside Chinamentioning
confidence: 99%