2015
DOI: 10.1002/cctc.201500787
|View full text |Cite
|
Sign up to set email alerts
|

Anti‐Coking Ni/SiO2 Catalyst for Dry Reforming of Methane: Role of Oleylamine/Oleic Acid Organic Pair

Abstract: We demonstrate the synthesis of silica‐supported Ni catalyst in the presence of oleylamine (OAm) and oleic acid (OAc) as the ligand and surfactant. Compared with OAm or OAc alone, Ni/SiO2 prepared with OAm/OAc organic pair showed a much smaller Ni particle, a much stronger metal–support interaction (MSI), an enhanced initial conversion of both CO2 and CH4 and a prolonged stability over 16 h with zero carbon deposition. How the OAm/OAc organic pair affects the catalyst formation mechanism is proposed: OAc intim… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

2
38
0

Year Published

2016
2016
2023
2023

Publication Types

Select...
7
1

Relationship

4
4

Authors

Journals

citations
Cited by 66 publications
(40 citation statements)
references
References 52 publications
(61 reference statements)
2
38
0
Order By: Relevance
“…The reducibility of catalysts was examined by using temperature‐programmed reduction (TPR; Figure ). All the catalysts show two reduction peaks; one in the relatively low temperature range of 540–580 °C, which is usually attributed to the reduction of Ni 2+ species that interact weakly with the support, mainly NiO in our case . The other is at a high temperature of 750–780 °C, which could be assigned to the reduction of Ni 2+ species in the PS phase with a strong metal–support interaction .…”
Section: Resultsmentioning
confidence: 56%
“…The reducibility of catalysts was examined by using temperature‐programmed reduction (TPR; Figure ). All the catalysts show two reduction peaks; one in the relatively low temperature range of 540–580 °C, which is usually attributed to the reduction of Ni 2+ species that interact weakly with the support, mainly NiO in our case . The other is at a high temperature of 750–780 °C, which could be assigned to the reduction of Ni 2+ species in the PS phase with a strong metal–support interaction .…”
Section: Resultsmentioning
confidence: 56%
“…Organic additives may also be useful in this regard. Gao et al (Table 1, entry 15) [42] prepared 5% Ni/SiO 2 catalysts promoted with oleylamine (OAm) and/or oleic acid (OAc) using an incipient wetness impregnation method. In this approach, OAm and/or OAc were used as surfactants, ligands, and/or reducing agents added on purpose to the solution of nickel nitrate prior to the impregnation in order to improve the dispersion of Ni on silica due to the strong interaction of the Ni precursors with OAm and OAc.…”
Section: Use Of Original Nickel Precursors or The Assistance Of Organic Moleculesmentioning
confidence: 99%
“…In this approach, OAm and/or OAc were used as surfactants, ligands, and/or reducing agents added on purpose to the solution of nickel nitrate prior to the impregnation in order to improve the dispersion of Ni on silica due to the strong interaction of the Ni precursors with OAm and OAc. Using a mixture of OAm and OAc with the spheres of mesoporous silica (particles size = 40-60 mm, specific surface area = 753 m 2 g -1 , mean pore size = 7.5 nm) produced, after calcination, small NiO particles in the Ni/SiO 2 -OAmc material, and therefore, after reduction by H 2 , to small Ni 0 NPs (Table 1, entries 5, 15) [32,42]. Using this approach, the authors managed to achieve 5% Ni/silica with a nickel dispersion of c.a.…”
Section: Use Of Original Nickel Precursors or The Assistance Of Organic Moleculesmentioning
confidence: 99%
“…Oleic acid is one of the most frequently applied surfactants for colloidal NP synthesis, also used in impregnation protocols for the preparation of supported NPs. [10][11] In the case of Ni-based colloidal synthesis, several protocols have been reported wherein oleic acid is used either solely or in combination with other (excluding P-containing) surfactants. [12][13][14][15][16] None of these works achieved particle size control in the 1-10 nm range.…”
Section: Introductionmentioning
confidence: 99%