2012
DOI: 10.1109/tvlsi.2011.2173220
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Analyzing the Impact of Joint Optimization of Cell Size, Redundancy, and ECC on Low-Voltage SRAM Array Total Area

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Cited by 12 publications
(4 citation statements)
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“…For accurate characteristics, we use 32-nm PTM High k/Metal-gate technology [26] (low-V th0 nMOS = |low-V th0 pMOS | = 0.49 V; high-V th0 nMOS = |high-V th0 pMOS | = 0.65 V; V DD = 0.9 V) and perform HSPICE simulations in the following analysis. To capture the process variation, the threshold voltage (V th ) variation for an nMOS (pMOS) transistor with minimum size is 24 mV (29.2 mV) [27]. Fig.…”
Section: Tm-rf: Circuit Implementationmentioning
confidence: 99%
“…For accurate characteristics, we use 32-nm PTM High k/Metal-gate technology [26] (low-V th0 nMOS = |low-V th0 pMOS | = 0.49 V; high-V th0 nMOS = |high-V th0 pMOS | = 0.65 V; V DD = 0.9 V) and perform HSPICE simulations in the following analysis. To capture the process variation, the threshold voltage (V th ) variation for an nMOS (pMOS) transistor with minimum size is 24 mV (29.2 mV) [27]. Fig.…”
Section: Tm-rf: Circuit Implementationmentioning
confidence: 99%
“…As this has become more challenging, several authors have proposed methods to improve SRAM reliability in the presence of NBTI/PBTI and GOBD degradation. These approaches include circuitry that periodically flips the data in an SRAM cell to reduce failure rates [66], the use of redundancy [67]- [69], error correcting codes [70], [71], and both [72]. Evaluation of these methods requires a model of cell stress.…”
Section: Chapter 2 Backgroundmentioning
confidence: 99%
“…However, those cheap devices, especially SRAM parts in the embedded systems, are vulnerable to the radiation effects. Due to the feedback mechanism for data retention in the SRAMs, the bit flips occur frequently in the high radiation environments [16]. The SRAM parts have to be hardened for radiation tasks.…”
Section: Introductionmentioning
confidence: 99%