Analytical Techniques for Controlled Collapse Bump Structures

Young, Rodney A.; Miranda, William R. Rodrigues de

doi:10.1109/irps.1982.361927

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1989

1991

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Cited by 3 publications

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“…The whole structure can be examined if one half of the hybrid is removed and techniques have been developed to dissolve away the entire silicon chip to leave the solder bonds and metallised pads intact. 18 This allows for inspection of the wettable metal/chip interface, but not the solder/wettable metal interface. This can be examined by removal of the solder, either by sodium hydroxide/nitrophenol etch to leave the intermetallics in place, or by other etches which will reveal the chip surfaces to allow checks on pad design, alignment and location.…”

Section: Destructive Testsmentioning

confidence: 99%

Techniques for the Inspection of Flip Chip Solder Bonded Devices

Burdett

Lodge

Pedder

1989

Microelectronics International

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After a brief introduction to the advantages and method of construction of flip chip solder bond devices, this paper looks at different techniques that can be used to inspect these devices at various stages in their construction. These techniques include optical, infra‐red, acoustic and electron microscopy, radiograph, electrical and tensile testing. The advantages and limitations of each of the techniques are discussed and an outline inspection schedule is suggested.

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Section: Destructive Testsmentioning

confidence: 99%