Analytical and finite element modeling of through glass via thermal stress

Benali, A.; Faqir, Mustapha; Bouya, Mohsine; Benabdellah, A.; Ghogho, Mounir

doi:10.1016/j.mee.2015.11.012

Cited by 18 publications

(5 citation statements)

References 15 publications

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“…A metallization process filled with Ag-paste composite solution was presented, and its effectiveness was compared with that of the general Cu electroplating process; the analytical results revealed that the aforementioned metallization process would introduce different cracking behaviors [ 19 ]. The analytical model and FEA simulation approach have been widely adopted to reduce the time-consuming experimental work due to the cost of the semiconductor fabrication process [ 20 , 21 , 22 ]. An analytical model was derived to estimate the thermal stress and warpage in terms of different geometrical parameters and material selections [ 20 , 21 ].…”

Section: Introductionmentioning

confidence: 99%

“…The analytical model and FEA simulation approach have been widely adopted to reduce the time-consuming experimental work due to the cost of the semiconductor fabrication process [ 20 , 21 , 22 ]. An analytical model was derived to estimate the thermal stress and warpage in terms of different geometrical parameters and material selections [ 20 , 21 ]. Heating temperature, dwell time, gap width, and surface tension were interpolated in the derived analytical model, and they influenced the reflow speed [ 22 ].…”

Section: Introductionmentioning

confidence: 99%

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Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach

et al. 2023

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The multi-chiplet technique is expected to be a promising solution to achieve high-density system integration with low power consumption and high usage ratio. This technique can be integrated with a glass interposer to accomplish a competitive low fabrication cost compared with the silicon-based interposer architecture. In this study, process-oriented stress simulation is performed by the element activation and deactivation technique in finite element analysis architecture. The submodeling technique is also utilized to mostly conquer the scale mismatch and difficulty in mesh gridding design. It is also used to analyze the thermomechanical responses of glass interposers with chiplet arrangements and capped epoxy molding compounds (EMC) during curing. A three-factor, three-level full factorial design is applied using the analysis of variance method to explore the significance of various structural design parameters for stress generation. Analytic results reveal that the maximum first principal stresses of 130.75 and 17.18 MPa are introduced on the sidewall of Cu-filled via and the bottom of the glass interposer, respectively. Moreover, the EMC thickness and through glass via pitch are the dominant factors in the adopted vehicle. They significantly influence the stress magnitude during heating and cooling.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach

et al. 2023

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“…For different filling materials of TGV, the crack formation mechanism can differ considerably; moreover, radial-type and circumferential-type cracks were found in electroplated Cu-filled TGV and sliver-paste-filled TGV during the heating process in [ 18 ]. The structural layout design factor of stress-to-size ratio was analyzed, and the analysis results showed that the Cu via thickness considerably affected the stress behavior in the glass interposer and should be carefully managed to reduce the stress and decrease the size of the package in [ 19 ]. Similar structures on both sides of the glass panel were preferred in order to minimize a process-induced warpage issue prior to assembly in [ 20 ].…”

Section: Introductionmentioning

confidence: 99%

Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach

et al. 2022

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In glass interposer architecture and its assembly process, the mechanical responses of interposer structure under thermocompression process-induced thermal loading and generated shrinkage of molding material are regarded as a major reliability issue. Thousands of metal-filled via are involved in glass interposers and are regarded as a potential risk that can lead to cracking and the failure of an entire vehicle. In this study, a finite element-based submodeling approach is demonstrated to overcome the complexity of modeling and the relevant convergence issue of interposer architecture. Convergence analysis results revealed that at least four via pitch-wide regions of a local simulation model were needed to obtain the stable results enabled by the submodeling simulation approach. The stress-generation mechanism during thermocompression, the coefficient of thermal expansion mismatch, and the curing process-induced shrinkage were separately investigated. The critical stress location was explored as the outer corner of the chip, and the maximum first principal stress during the thermocompression process generated on the chip and glass interposer were 34 and 120 MPa, respectively.

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“…Interposer-based 2.5 D integration, where heterogeneous chips are stacked on an interposer substrate, is one of the most promising technologies to offer high input/output (I/O) density, low power consumption and small form factor for high-performance applications such as mobile and cloud computing (Benali et al , 2016; Zhang et al , 2016). As a mature semiconductor material, silicon (Si) has often been chosen as the interposer substrate to provide effective solutions to system integration.…”

Section: Introductionmentioning

confidence: 99%

The effect of materials and design on the reliability of through-glass vias for 2.5 D integrated circuits: a numerical study

Ahmed

Okoro

Pollard

et al. 2020

MMMS

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PurposeThis study aims to investigate the factors responsible for substrate cracking reliability problem in through-glass vias (TGVs), which are critical components for glass-based 2.5 D integration.Design/methodology/approachNumerical models were used to examine the driving force for substrate cracking in glass interposers due to stress coupling during heating. An analytical solution was used to demonstrate how the energy release rate (ERR) for the glass substrate cracking is affected by the via design and the mismatch in thermal strain. Then, the numerical models were implemented to investigate the design factors effects, such as the pitch distance, via diameter, via pattern, via design, effect from a stress buffer layer and the interposer materials selection on the susceptibility to substrate cracking.FindingsERR for substrate cracking was found to be directly proportional to the via diameter and the thermal mismatch strain. When a via pattern is implemented for high-density integration, a coupling in the stress fields was identified. This coupling effect was found to depend on the pitch distance, the position of the vias, and the via arrangement, suggesting a via pattern-dependent reliability behavior for glass interposers. Changing the design of the via to an annular shape or a substrate-cored via was found to be a promising approach to reduce the susceptibility to substrate cracking compared to a fully filled solid via. Also, the use of a stress buffer layer, an encouraging design prospect presented for the first time for TGVs in this study, was found to significantly reduce cracking. Finally, alternative via and substrate materials showed lower tendency for substrate cracking, indicating that the reliability of glass interposers can be further enhanced with the implementation of such new materials.Originality/valueThis study signifies the first attempt to comprehensively evaluate the susceptibility to crack formation in glass interposers during heating. Therefore, this study provides new perspectives on how to achieve a significant potential reliability improvement for TGVs.

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Analytical and finite element modeling of through glass via thermal stress

Cited by 18 publications

References 15 publications

Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach

Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach

Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach

The effect of materials and design on the reliability of through-glass vias for 2.5 D integrated circuits: a numerical study

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