1987
DOI: 10.1016/0167-9317(87)90014-1
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Analysis strategy for internal measurements on VLSI devices

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Cited by 3 publications
(2 citation statements)
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“…Also important are chip manipulation a n d repair. 4 Selectively separating interconnections can help isolate a n electrical malfunction a n d identify a possible e n c e d the chip's general functionality.…”
Section: Iochen Kolzermentioning
confidence: 99%
“…Also important are chip manipulation a n d repair. 4 Selectively separating interconnections can help isolate a n electrical malfunction a n d identify a possible e n c e d the chip's general functionality.…”
Section: Iochen Kolzermentioning
confidence: 99%
“…In an extreme case of failure analysis the storage function of a memory device was crippled by systematic defects inside the chip's periphery which could be observed, localized and identified. A further step taken was laser manipulation at the chip level, which restored the chip's functionality [6] The comprehensive analysis strategy used here places a greater emphasis on verifying the failure cause through chip manipulation, resulting in a steeper learning curve during the product development.…”
mentioning
confidence: 99%