Proceedings of the 2005 ACM/SIGDA 13th International Symposium on Field-Programmable Gate Arrays 2005
DOI: 10.1145/1046192.1046211
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Analysis of yield loss due to random photolithographic defects in the interconnect structure of FPGAs

Abstract: This paper presents an analysis of the potential yield loss in FPGA due to random defects in metal layers. A proven yield model is adapted to target the FPGA interconnect layers in order to predict the manufacturing yield. Defect parameters from the 2003 SIA roadmap are used to investigate the trend in yield loss due to defects in interconnect layers in the future. It is shown that the low yield predicted for the 45nm technology node and beyond is a cause for concern. The potential impact on yield using two di… Show more

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Cited by 48 publications
(48 citation statements)
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“…In some cases fault can also occur after the chip has been manufactured and tested. In our approach the fact that we modify the configuration bit stream in Hardware inside the chip rather than software allow us to handle such faults [2].…”
Section: Proposed Techniquementioning
confidence: 99%
See 1 more Smart Citation
“…In some cases fault can also occur after the chip has been manufactured and tested. In our approach the fact that we modify the configuration bit stream in Hardware inside the chip rather than software allow us to handle such faults [2].…”
Section: Proposed Techniquementioning
confidence: 99%
“…In this paper we propose a new FPGA like architecture which incorporate fault tolerance in the fabric. Various defects may be produced in a VLSI chip during manufacturing [2]. The existence of defects affects yield and ultimately cost.…”
Section: Introductionmentioning
confidence: 99%
“…Minimizing the yield loss from defects is an ongoing concern and it may be an even greater challenge in future technologies. For FPGAs it has been predicted that the yield in 22 nm CMOS may be 25% lower than in 90 nm CMOS for the same amount of logic [48].…”
Section: Manufacturing Defectsmentioning
confidence: 99%
“…Compared to ASICs, FPGAs have attained a central focus due to their ability to integrate more complex applications, their flexibility and good performance. Considering that FPGAs based on nanotechnology may have a defect rate of 20% [3] [4], propose techniques to avoid these defects is necessary. Several studies examined the effect of redundancy techniques on the performance of FPGAs.…”
Section: Introductionmentioning
confidence: 99%