2011
DOI: 10.7498/aps.60.054401
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Analysis of theoretical model of thermal infrared imager based on the substrate-free focal plane array

Abstract: Based on thermal deformation of bi-material microcantilever, the focal plane array (FPA)of uncooled optical readout infrared(IR) imaging system has undergone a development from substrate array to substrate-free array. The experimental imaging result and finite element method (FEM) analysis indicated that the substrate-free focal plane array (FPA) did not accord with the condition of constant frame temperature. This paper proposed a new theoretical model on thermal transmission of substrate-free FPA with electr… Show more

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Cited by 3 publications
(1 citation statement)
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“…Similarly, the supporting frame in the heataffected zone is also considered to be an equivalent element with an average temperature rise of ΔT mfrm , and the heat exchanges are equivalent to three parallel resistances: R mfrm,cond , R mfrm,rad , R mfrm,air , and can be expressed as [10]…”
Section: Ir Absorber (T C )mentioning
confidence: 99%
“…Similarly, the supporting frame in the heataffected zone is also considered to be an equivalent element with an average temperature rise of ΔT mfrm , and the heat exchanges are equivalent to three parallel resistances: R mfrm,cond , R mfrm,rad , R mfrm,air , and can be expressed as [10]…”
Section: Ir Absorber (T C )mentioning
confidence: 99%