A substrate-free optical readout focal plane array with a heat sink structure

Rmwen, Liu; Kong, Yanmei; Jiao, Binbin; Li, Zhigang; Shang, Haiping; Lu, Dike; Gao, Chunqing; Chen, Dapeng; Zhang, Qingchuan

doi:10.1088/1674-4926/34/2/024005

Cited by 2 publications

References 18 publications

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A low-cost infrared absorbing structure for an uncooled infrared detector in a standard CMOS process

Shan¹,

Tang²,

Yu³

et al. 2014

J. Semicond.

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This paper introduces a low-cost infrared absorbing structure for an uncooled infrared detector in a standard 0.5 m CMOS technology and post-CMOS process. The infrared absorbing structure can be created by etching the surface sacrificial layer after the CMOS fabrication, without any additional lithography and deposition procedures. An uncooled infrared microbolometer is fabricated with the proposed infrared absorbing structure. The microbolometer has a size of 65 65 m 2 and a fill factor of 37.8%. The thermal conductance of the microbolometer is calculated as 1.33 10 5 W/K from the measured response to different heating currents. The fabricated microbolometer is irradiated by an infrared laser, which is modulated by a mechanical chopper in a frequency range of 10-800 Hz. Measurements show that the thermal time constant is 0.995 ms and the thermal mass is 1.32 10 8 J/K. The responsivity of the microbolometer is about 3.03 10 4 V/W at 10 Hz and the calculated detectivity is 1.4 10 8 cm Hz 1=2 /W.

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A low-cost infrared absorbing structure for an uncooled infrared detector in a standard CMOS process

Shan¹,

Tang²,

Yu³

et al. 2014

J. Semicond.

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Thermal Imaging in Smart Applications

Rehman

Javid

Khan

et al.

Recent Advances in Applied Thermal Imaging for Industrial Applications

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Temperature measurement is an essential requirement for a large number of smart applications in medicine, agriculture, environment, and security domains, to name but a few. Conventionally, temperature measurements are mostly performed using thermometers, thermocouples, thermistors, and resistance temperature detectors. Most of these instruments require physical contact with the object to measure temperature at specific points. Infrared thermography has revolutionized the concept of temperature measurement. Infrared thermal imaging (IRTI) can provide the temperature mapping without a physical contact with the object of interest from a reasonable distance. A typical IRTI system comprises of a thermal camera equipped with infrared detector, a signal processing unit and an image acquisition system, usually in the form of an embedded system. Such cameras are utilized for applications like fault detection, irrigation management, motion detection, etc. This chapter briefly introduces use of thermal imaging in medicine, agriculture, environment, smart home/cities and security applications.

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A substrate-free optical readout focal plane array with a heat sink structure

Cited by 2 publications

References 18 publications

A low-cost infrared absorbing structure for an uncooled infrared detector in a standard CMOS process

A low-cost infrared absorbing structure for an uncooled infrared detector in a standard CMOS process

Thermal Imaging in Smart Applications

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