2017
DOI: 10.1063/1.4986756
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Analysis of the reverse I-V characteristics of diamond-based PIN diodes

Abstract: Diamond is one of the most promising candidates for high power and high temperature applications, due to its large bandgap and high thermal conductivity. As a result of the growth and fabrication process of diamond-based devices, structural defects such as threading dislocations (TDs) may degrade the electrical properties of such devices. Understanding and control of such defects are important for improving device technology, particularly the reverse breakdown characteristics. Here, we show that the reverse bi… Show more

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Cited by 47 publications
(20 citation statements)
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“…Temperature has a strong impact on leakage current under high reverse bias. The thermionic emission is positive correlated with temperature, thus, the Frenkel-Poole Emission (PFE) is a domination conduction mechanism in vertical GaN Schottky diodes at high electronic field and high temperature [11,51]. Additionally, trap-assisted tunneling (TAT) is also a temperature-dependent mechanism that causes increase in leakage current [50].…”
Section: Reverse Breakdown Characteristicsmentioning
confidence: 99%
See 1 more Smart Citation
“…Temperature has a strong impact on leakage current under high reverse bias. The thermionic emission is positive correlated with temperature, thus, the Frenkel-Poole Emission (PFE) is a domination conduction mechanism in vertical GaN Schottky diodes at high electronic field and high temperature [11,51]. Additionally, trap-assisted tunneling (TAT) is also a temperature-dependent mechanism that causes increase in leakage current [50].…”
Section: Reverse Breakdown Characteristicsmentioning
confidence: 99%
“…Wide band gap materials (e.g., silicon carbide (SiC), gallium nitride (GaN), and diamond) have recently attracted a lot of interest for high power and high temperature applications [3][4][5][6][7][8]. SiC-based power devices have been already commercialized for high-voltage and high-power application [9,10]; diamond is another promising candidate [11,12]. Among all of these wide bandgap semiconductor material, GaN has a higher electron mobility than SiC and higher critical electric field than Si [13].…”
Section: Introductionmentioning
confidence: 99%
“…The field of CVD diamonds is rapidly maturing into one wherein new applications and products are being developed [ 1 , 2 ]. It is a currently emerging technology with immense promise for innovative, convenient, and high-performance electronics.…”
Section: Introductionmentioning
confidence: 99%
“…At present, most power semiconductor devices are fabricated from Si materials, but as the process progresses, the performance of Si devices is approaching the material limit. Therefore, wide-bandgap semiconductor materials such as diamond [1,2], SiC [3,4], and GaN [5] have become promising candidates to make high power semiconductor devices. These wide-bandgap semiconductor materials have a high breakdown field [2], high thermal conductivity [6,7], and an extremely low intrinsic carrier concentration at room temperature, which can make power devices with high potential figures of merit [2].…”
Section: Introductionmentioning
confidence: 99%