Analysis of the optimal dimension on the electrothermal microactuator

Chen, Rongsheng; Kung, Chieh; Lee, Gwo‐Bin

doi:10.1088/0960-1317/12/3/315

Cited by 56 publications

(39 citation statements)

References 6 publications

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“…The same approach, i.e. applying purely convective heat transfer on all surfaces of the microactuator, was employed in a variety of other thermal modeling studies (Jungen et al [13], Chen et al [14], Todd and Xie [15], Yang and Yu [16]). …”

Section: Review Of Modeling Approachesmentioning

confidence: 99%

On heat transfer at microscale with implications for microactuator design

Ozsun¹,

Alaca²,

Yalçınkaya³

et al. 2009

J. Micromech. Microeng.

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The dominance of conduction and the negligible effect of gravity, and hence free convection, are verified in the case of microscale heat sources surrounded by air at atmospheric pressure. A list of temperature-dependent heat transfer coefficients is provided. In contrast to previous approaches based on free convection, supplied coefficients converge with increasing temperature. Instead of creating a new external function for the definition of boundary conditions via conductive heat transfer, convective thin film coefficients already embedded in commercial finite element software are utilized under a constant heat flux condition. This facilitates direct implementation of coefficients, i.e. the list supplied in this work can directly be plugged into commercial software. Finally, the following four-step methodology is proposed for modeling: (i) determination of the thermal time constant of a specific microactuator, (ii) determination of the boundary layer size corresponding to this time constant, (iii) extraction of the appropriate heat transfer coefficients from a list provided and (iv) application of these coefficients as boundary conditions in thermomechanical finite element simulations. An experimental procedure is established for the determination of the thermal time constant, the first step of the proposed methodology. Based on conduction, the proposed method provides a physically sound solution to heat transfer issues encountered in the modeling of thermal microactuators.

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Section: Review Of Modeling Approachesmentioning

confidence: 99%

On heat transfer at microscale with implications for microactuator design

Ozsun¹,

Alaca²,

Yalçınkaya³

et al. 2009

J. Micromech. Microeng.

View full text Add to dashboard Cite

show abstract

“…Many works have been done in modeling electro-thermal and thermo-mechanical behavior of thermal flexure actuators (Chen et al 2002;Lott et al 2002;Mankame and Ananthasuresh 2001;Huang and Lee 2000;Huang and Lee 1999;Kuang et al 2002;Pan and Hsu 1997;Yan et al 2003;Geisberger et al 2003;Atre 2006;Shamshirsaz and Gheisarieha 2004). R.S.…”

Section: Introductionmentioning

confidence: 99%

“…R.S. Chen et al used FEA to model an electro thermal micro actuator and evaluate its tip deflection and assumed constant thermo-mechanical properties over a wide rang of temperature (Chen et al 2002). The thermal behavior of thermo-mechanical in-plan micro actuators has been modeled using a finite difference approach by Lott et al (2002).…”

Section: Introductionmentioning

confidence: 99%

Polysilicon micro beams buckling with temperature-dependent properties

Shamshirsaz

Asgari²

2008

Microsyst Technol

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The suspended electrothermal polysilicon micro beams generate displacements and forces by thermal buckling effects. In the previous electro-thermal and thermoelastic models of suspended polysilicon micro beams, the thermo-mechanical properties of polysilicon have been considered constant over a wide rang of temperature (20-900°C). In reality, the thermo-mechanical properties of polysilicon depend on temperature and change significantly at high temperatures. This paper describes the development and validation of theoretical and Finite element model (FEM) including the temperature dependencies of polysilicon properties such as thermal expansion coefficient and Young's modulus. In the theoretical models, two parts of elastic deflection model and thermal elastic model of micro beams buckling have been established and simulated. Also, temperature dependent buckling of polysilicon micro beam under high temperature has been modeled by Finite element analysis (FEA). Analytical results and numerical results using FEA are compared with experimental data available in literature. Their reasonable agreement validates analytical model and FEM. This validation indicates the importance of including temperature dependencies of polysilicon thermomechanical properties such as Coefficient of thermal expansion (CTE) in the previous models.

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“…Generally, modeling of the electrothermal microactuator has to take electro-thermal-mechanical couples into account. Efforts to model the electrothermal actuators have focused on finite-element (FEM) (Lerch et al 1996;Mankame and Ananthasuresh 2001;Chen et al 2002;Geisberger et al 2003;Borovic et al 2005), finite difference method (FDM) (Kuang et al 2002;Lott et al 2002), lumped parameter (Huang and Lee 1999a, b;Hickey et al 2003;Yan et al 2003), and model order reduction (Yang and Yu 2004).…”

Section: Introductionmentioning

confidence: 99%

A nodal analysis model for the out-of-plane beamshape electrothermal microactuator

Huang

2008

Microsyst Technol

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This paper introduces a nodal analysis model for the out-of-plane beamshaped electrothermal microactuators. The electrothermal microactuator is traditionally simulated with finite element method (FEM) due to the complex coupling of the electrical, thermal and mechanical problem. This complex problem is classified into two parts in this paper: the coupling electrothermal problem and the coupling thermomechanical problem. By utilizing the characteristic of the temperature distribution, the nodal analysis model for the coupling electrothermal behavior of the electrothermal microactuator is built. The model scale is much smaller than the finite element model, which results in less computational consumption. Then the coupling thermomechanical behavior, such as the shift of the heat flow from the bottom of each part of the actuator to the substrate due to its out-of-plane movement, is modeled to make the model more reasonable. Many other effects which remarkably influence the behavior of the actuator are also taken into account. This model is verified by available experimental results, and achieves an agreement.

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Analysis of the optimal dimension on the electrothermal microactuator

Cited by 56 publications

References 6 publications

On heat transfer at microscale with implications for microactuator design

On heat transfer at microscale with implications for microactuator design

Polysilicon micro beams buckling with temperature-dependent properties

A nodal analysis model for the out-of-plane beamshape electrothermal microactuator

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