A nodal analysis model for the out-of-plane beamshape electrothermal microactuator

Li, Rengang; Huang, Qing‐An; Li, Weihua

doi:10.1007/s00542-008-0662-8

Cited by 5 publications

(5 citation statements)

References 31 publications

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“…One way to model them is by using electrical analogy. Thermal network approach can provide rapid simulation (the model scale is much smaller than the FE model) with fairly high accuracy [42,57]. However, electrical analogy is not currently developed for beam geometries, commonly found on thermal micro-actuators, and having heat transfers through and around length.…”

Section: Model Order Reductionmentioning

confidence: 99%

“…Few years later, Codecasa proposes passive compact models of dynamic thermal networks with many heat sources [56]. Recently, Li et al used a nodal analysis method based on circuit analogy for simulating the responses of surface micromachined electrothermal micro-actuators and an out-of-plane beamshaped electrothermal micro-actuator [42,57]; a lumped approach that decomposes the static and dynamic performances of an U-shape micro-actuator into a series of thermal networks and a mechanical frame has been adopted by Lo et al [58]; and Szabo and Szekely presented thermal networks, defined experimentally or analytically, of a quadratic transfer characteristics (QTC) element of which driving principle is the Seebeck effect [59].…”

Section: Modelling Using Electrical Analogymentioning

confidence: 99%

“…Electrothermal devices are traditionally simulated with finite element method (FEM) due to the complex coupling of the electrical, thermal and mechanical problem [42]. FEM analysis is principally used to demonstrate the feasibility of the design and to simulate the behaviour; for example, the relationship between the applied voltage and the displacement [1,37,43,44], or the effects of geometrical and material stiffness variations on the performance [45].…”

Section: Finite Element Modellingmentioning

confidence: 99%

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Dynamic modelling for thermal micro-actuators using thermal networks

López-Walle

Gauthier

Chaillet

2010

International Journal of Thermal Sciences

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a b s t r a c tThermal actuators are extensively used in microelectromechanical systems (MEMS). Heat transfer through and around these microstructures are very complex. Knowing and controlling them in order to improve the performance of the micro-actuator, is currently a great challenge. This paper deals with this topic and proposes a dynamic thermal modelling of thermal micro-actuators. Thermal problems may be modelled using electrical analogy. However, current equivalent electrical models (thermal networks) are generally obtained considering only heat transfers through the thickness of structures having considerable height and length in relation to width (walls). These models cannot be directly applied to microactuators. In fact, micro-actuator configurations are based on 3D beam structures, and heat transfers occur through and around length. New dynamic and static thermal networks are then proposed in this paper. The validities of both types of thermal networks have been studied. They are successfully validated by comparison with finite elements simulation and analytical calculations.

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Section: Model Order Reductionmentioning

confidence: 99%

Section: Modelling Using Electrical Analogymentioning

confidence: 99%

Section: Finite Element Modellingmentioning

confidence: 99%

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Dynamic modelling for thermal micro-actuators using thermal networks

López-Walle

Gauthier

Chaillet

2010

International Journal of Thermal Sciences

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“…Almost the analysis in thermal actuators implemented the finite element method (FEM) due to the relation between electrical, thermal and mechanical analysis. Li et al [21] investigate an out-of-plane mechanism with the assist of FEM to evaluate the characteristic of the model.…”

Section: Introductionmentioning

confidence: 99%

Design and Simulation Electrothermal Double-Step Structure for Out-of-Plane Actuation

2020

IJATCSE

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Out-of-plane actuators have a vital role in the micro-electro-mechanical system (MEMS). Various thermal actuators are applied for the mechanism. The paper proposed the development of a double-stepped beam structure for large out-of-plane displacement output. The structure combines the flexible segments and rigid links. The Joule heating effect drives the device. The performance of this mechanism is the analysis and simulated by Abaqus software. Compared to a single stepped beam design reported in the literature, the proposed double-stepped beam structure can deliver a much larger out-of-plane displacement. Under an applied current of 6 mA, the double stepped beam's maximum deflection is nearly three times higher than that of the single stepped beam structure. The effects of stepped beam parameters are investigated in the design mechanism.

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“…For instance, Bullen et al [14] and Watanabe et al [15] approach a thermally actuated microbeam by means of a deflection curve of a composite beam, including the heat conduction formulation for the static case. Li et al [16], in contrast, approach the coupled electro-thermo-mechanical problem by means of a nodal analysis, utilizing circuit simulation software to achieve a less computational expensive model. Approaches in view of a dynamical analysis of coupled thermo-mechanical fields focus on the effects of thermal damping in microbeams [17]- [19].…”

mentioning

confidence: 99%

Tip Motion—Sensor Signal Relation for a Composite SPM/SPL Cantilever

Roeser

Gutschmidt

Sattel

et al. 2016

J. Microelectromech. Syst.

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Abstract-An array of microbeams is a promising approach to increase the throughput of scanning probe microscopes and lithography. This concept requires integrated sensors and actuators which enable individual measurement and control. Thus, existing models for single beams need to be reassessed in view of its applicability for arrays, which involve additional physical interactions and a varying geometry along the beam's length. This paper considers a single composite microbeam, which is excited by a thermal actuator and its displacement is measured by a piezoresistive sensor. We derive a model that incorporates the beam's composite structure, varying geometry along its length, its thermal coupling for actuation, and thermoelastic damping. Subsequently, the influence of the beam's geometry on its eigenmodes and frequencies is analyzed in far and close proximity operation to a surface. We observe parametric excitation phenomena of multiple integers of the fundamental excitation frequency, which originates from the geometrical composition of the beam. Furthermore, we observe that the so far constant assumed factor to convert the sensor signal to the beam's displacement depends on the dissipated power within the actuator, as well as on the dynamic behavior of the system, and thus is not constant.[2015-0208]

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A nodal analysis model for the out-of-plane beamshape electrothermal microactuator

Cited by 5 publications

References 31 publications

Dynamic modelling for thermal micro-actuators using thermal networks

Dynamic modelling for thermal micro-actuators using thermal networks

Design and Simulation Electrothermal Double-Step Structure for Out-of-Plane Actuation

Tip Motion—Sensor Signal Relation for a Composite SPM/SPL Cantilever

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