Analysis of the Factors Limiting the RF Breakdown Voltage in SiGe HBTs for Wi-Fi PA Applications

Raman, A.; Jain, Vibhor; Veeramani, Elanchezhian; Lim, Beng Woon; Raghunathan, Uppili S.; Ngu, Yves; Joseph, A.J.

doi:10.1109/bcicts50416.2021.9682457

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Analysis of the Factors Limiting the RF Breakdown Voltage in SiGe HBTs for Wi-Fi PA Applications

Cited by 3 publications

References 3 publications

Impact of Layout Parasitics and Thermal Coupling on PA performance and ruggedness in SiGe HBTs

Impact of Layout Parasitics and Thermal Coupling on PA performance and ruggedness in SiGe HBTs

Simulation of DC Safe Operating Area and RF Breakdown in SiGe PA HBT

Assessing DC and RF Reliability of SiGe HBTs Stress-Engineered Using Dummy BEOL Layers

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