Analysis of SiC Schottky diodes after thermal vacuum test by means of lock-in infrared thermography

Vellvehı́, M.; Perpiñà, X.; Aviñó-Salvadó, Oriol; Ferrer, Conrad; Fuste, Naum; Sanchez, Debbie; Jordà, X.; Godignon, P.; Massetti, Silvia

doi:10.1109/eurosime48426.2020.9152625

Cited by 1 publication

(1 citation statement)

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“…Direct contact methods rely on the application of a temperature sensor directly to a semiconductor junction. Noncontact direct methods rely on estimating the temperature of a semiconductor junction on the basis of optical radiation emitted by the junction [ 8 ]. It is also possible to estimate the junction temperature on the basis of the angle of reflection of the optical radiation from the semiconductor element [ 9 ].…”

Section: Introductionmentioning

confidence: 99%

The Estimated Temperature of the Semiconductor Diode Junction on the Basis of the Remote Thermographic Measurement

Hulewicz

Dziarski

Krawiecki

2023

Sensors

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The value of a semiconductor’s diode temperature determines the correct operation of this element and its useful lifetime. One of the methods for determining the die temperature of a semiconductor diode is through the use of indirect thermographic measurements. The accuracy of the thermographic temperature measurement of the diode case depends on the prevailing conditions. The temperature of the mold body (the black part of the diode case made of epoxy resin) depends on the place of measurement. The temperature of the place above the die is closer to the die temperature than the temperature of mold body fragments above the base plate. In addition, the difficulty of its thermographic temperature measurement increases when the surface whose temperature is being measured is in motion. Then, the temperature measured by thermography may not apply to the warmest point in the case where the die temperature is determined. Information about the difference between temperatures of the different parts of the mold body and the die may be important. For this reason, it was decided to check how much the temperature measurement error of the die diode changes if the temperature of the diode case is not measured at the point that is above the die.

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Section: Introductionmentioning

confidence: 99%